| Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs V Sukumaran, T Bandyopadhyay, V Sundaram, R Tummala IEEE, 0 | 234 | |
| Through-package-via formation and metallization of glass interposers V Sukumaran, Q Chen, F Liu, N Kumbhat, T Bandyopadhyay, H Chan, ... Electronic Components and Technology Conference (ECTC), 2010 Proceedings …, 2010 | 144 | 2010 |
| Design, fabrication, and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as TSVs in silicon V Sukumaran, G Kumar, K Ramachandran, Y Suzuki, K Demir, Y Sato, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014 | 126 | 2014 |
| Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias V Sukumaran, T Bandyopadhyay, Q Chen, N Kumbhat, F Liu, R Pucha, ... Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 583-588, 2011 | 95 | 2011 |
| Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same V Sundaram, F Liu, R Tummala, V Sukumaran, V Sridharan, Q Chen US Patent 9,275,934, 2016 | 74 | 2016 |
| Trend from ICs to 3D ICs to 3D systems RR Tummala, V Sundaram, R Chatterjee, PM Raj, N Kumbhat, ... Custom Integrated Circuits Conference, 2009. CICC'09. IEEE, 439-444, 2009 | 68 | 2009 |
| Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV) V Sridharan, S Min, V Sundaram, V Sukumaran, S Hwang, H Chan, F Liu, ... Electronic Components and Technology Conference (ECTC), 2010 Proceedings …, 2010 | 60 | 2010 |
| Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications G Kumar, T Bandyopadhyay, V Sukumaran, V Sundaram, SK Lim, ... Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 217-223, 2011 | 59 | 2011 |
| Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules Y Sato, S Sitaraman, V Sukumaran, B Chou, J Min, M Ono, C Karoui, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1656-1661, 2013 | 34 | 2013 |
| Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages K Demir, K Ramachandran, Y Sato, Q Chen, V Sukumaran, R Pucha, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 353-359, 2013 | 32 | 2013 |
| Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules S Sitaraman, V Sukumaran, MR Pulugurtha, Z Wu, Y Suzuki, Y Kim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 25 | 2017 |
| Modeling, design, and fabrication of ultra-high bandwidth 3D Glass Photonics (3DGP) in glass interposers BC Chou, Y Sato, V Sukumaran, J Sun, V Sundaram, GK Chang, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 286-291, 2013 | 20 | 2013 |
| High density electrical interconnections in liquid crystal polymer (LCP) substrates for retinal and neural prosthesis applications V Sundaram, V Sukumaran, ME Cato, F Liu, R Tummala, PJ Nasiatka, ... Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1308 …, 2011 | 18 | 2011 |
| Integrated circuit structure having through-silicon via and method of forming same V Sukumaran, TL Tran-Quinn, JA Lubguban, JJ Garant US Patent 9,805,977, 2017 | 9 | 2017 |
| Through-package-via hole formation, metallization and characterization for ultra-thin 3D glass interposer packages V Sukumaran Georgia Institute of Technology, 2014 | 9 | 2014 |
| Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications K Demir, V Sukumaran, Y Sato, A El Amrani, K Ramachandran, R Pucha, ... Journal of Materials Science: Materials in Electronics, 1-12, 2018 | 8 | 2018 |
| Dicing channels for glass interposers BL Hedrick, V Sukumaran, CL Tessler, RF Indyk, SH Knickerbocker US Patent App. 10/090,255, 2018 | 7* | 2018 |
| Dicing channels for glass interposers BL Hedrick, V Sukumaran, CL Tessler, RF Indyk, SH Knickerbocker US Patent App. 15/010,868, 2016 | 7 | 2016 |
| End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications B Hedrick, V Sukumaran, B Fasano, C Tessler, J Garant, J Lubguban, ... Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, 283-288, 2016 | 6 | 2016 |
| THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND METHODS FOR FABRICATING SAME V Sundaram, F Liu, RR Tummala, V Sukumaran, V Sridharan, Q Chen US Patent 20,160,141,257, 2016 | 5* | 2016 |
