8.2 8Mb/s 28Mb/mJ robust true-random-number generator in 65nm CMOS based on differential ring oscillator with feedback resistors E Kim, M Lee, JJ Kim 2017 IEEE International Solid-State Circuits Conference (ISSCC), 144-145, 2017 | 72 | 2017 |
Architecture, chip, and package co-design flow for 2.5 D IC design enabling heterogeneous IP reuse J Kim, G Murali, H Park, E Qin, H Kwon, V Chaitanya, K Chekuri, N Dasari, ... Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019 | 51 | 2019 |
Architecture, chip, and package codesign flow for interposer-based 2.5-D chiplet integration enabling heterogeneous IP reuse J Kim, G Murali, H Park, E Qin, H Kwon, VCK Chekuri, NM Rahman, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (11 …, 2020 | 48 | 2020 |
Mixture of pre-processing experts model for noise robust deep learning on resource constrained platforms T Na, M Lee, BA Mudassar, P Saha, JH Ko, S Mukhopadhyay 2019 International Joint Conference on Neural Networks (IJCNN), 1-7, 2019 | 17 | 2019 |
Effect of process variations in digital pixel circuits on the accuracy of DNN based smart sensor M Lee, M Mukherjee, P Saha, MF Amir, T Na, S Mukhopadhyay 2020 2nd IEEE International Conference on Artificial Intelligence Circuits …, 2020 | 7 | 2020 |
Reliable edge intelligence in unreliable environment M Lee, X She, B Chakraborty, S Dash, B Mudassar, S Mukhopadhyay 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE), 896-901, 2021 | 6 | 2021 |
Algorithm-circuit cross-layer control for digital pixel image sensors M Mukherjee, BA Mudassar, M Lee, S Mukhopadhyay 2020 IEEE SENSORS, 1-4, 2020 | 6 | 2020 |
Automated generation of all-digital I/0 library cells for system-in-package integration of multiple dies M Lee, A Singh, HM Torun, J Kim, S Lim, M Swaminathan, ... 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 6 | 2018 |
AFE-CIM: A Current-Domain Compute-In-Memory Macro for Analog-to-Feature Extraction S Sharma, WC Wang, C DeLude, M Lee, NM Rahman, NV Kidambi, ... ESSCIRC 2023-IEEE 49th European Solid State Circuits Conference (ESSCIRC), 33-36, 2023 | 4 | 2023 |
Warningnet: A deep learning platform for early warning of task failures under input perturbation for reliable autonomous platforms M Lee, B Mudassar, T Na, S Mukhopadhyay 2020 57th ACM/IEEE Design Automation Conference (DAC), 1-6, 2020 | 4 | 2020 |
A Spatiotemporal Pre-processing Network for Activity Recognition under Rain M Lee, B Mudassar, T Na, S Mukhopadhyay | 4 | 2019 |
Adaptive Camera Platform Using Deep Learning-Based Early Warning of Task Failures M Lee, BA Mudassar, S Mukhopadhyay IEEE Sensors Journal 21 (12), 13794-13804, 2021 | 3 | 2021 |
Cross-layer noise analysis in smart digital pixel sensors with integrated deep neural network M Lee, M Mukherjee, E Lee, P Saha, MF Amir, T Na, S Mukhopadhyay IEEE Journal on Emerging and Selected Topics in Circuits and Systems 10 (4 …, 2020 | 3 | 2020 |
Automated I/O library generation for interposer-based system-in-package integration of multiple heterogeneous dies M Lee, A Singh, HM Torun, J Kim, SK Lim, M Swaminathan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 3 | 2019 |
CLUE: Cross-Layer Uncertainty Estimator for Reliable Neural Perception using Processing-in-Memory Accelerators M Lee, A Lu, M Mukherjee, S Yu, S Mukhopadhyay 2023 International Joint Conference on Neural Networks (IJCNN), 01-08, 2023 | 1 | 2023 |
Forecasting Local Behavior of Self-organizing Many-agent System without Reconstruction B Kang, M Lee, H Kumar, S Mukhopadhyay arXiv preprint arXiv:2210.17289, 2022 | 1 | 2022 |
Lightweight Model Uncertainty Estimation for Deep Neural Object Detection M Lee, B Mudassar, S Mukhopadhyay 2022 International Joint Conference on Neural Networks (IJCNN), 1-8, 2022 | 1 | 2022 |
Energy Efficient Pixel-Parallel Read-Out Circuits for Digital Image Sensors Using Cross-Layer Pixel Depth Control M Mukherjee, BA Mudassar, M Lee, E Lee, S Mukhopadhyay IEEE Sensors Journal 22 (12), 11317-11327, 2021 | 1 | 2021 |
On the design of energy-efficient I/O circuits for interposer-based 2.5 D system-in-package M Lee, J Kim, A Singh, HM Torun, M Swaminathan, S Lim, ... 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2018 | 1 | 2018 |
Learning Locally Interacting Discrete Dynamical Systems: Towards Data-Efficient and Scalable Prediction B Kang, H Kumar, M Lee, B Chakraborty, S Mukhopadhyay arXiv preprint arXiv:2404.06460, 2024 | | 2024 |