팔로우
Rao Tummala
Rao Tummala
소속을 알 수 없음
ece.gatech.edu의 이메일 확인됨
제목
인용
인용
연도
Microelectronics Packaging Handbook: Semiconductor Packaging
RR Tummala, EJ Rymaszewski, AG Klopfenstein
Springer Science & Business Media, 2013
23502013
Fundamentals of microsystems packaging
RR Tummala
McGraw-Hill 2 (01), 190-193, 2001
14942001
Ceramic and glass‐ceramic packaging in the 1990s
RR Tummala
Journal of the American Ceramic Society 74 (5), 895-908, 1991
10421991
ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across Au electrodes
CS Lao, J Liu, P Gao, L Zhang, D Davidovic, R Tummala, ZL Wang
Nano Letters 6 (2), 263-266, 2006
4612006
SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade
RR Tummala
IEEE Transactions on Advanced Packaging 27 (2), 241-249, 2004
3482004
A review of SiC power module packaging technologies: Challenges, advances, and emerging issues
H Lee, V Smet, R Tummala
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019
3062019
Introduction to System on Package (SOP).
R Tummala, M Swaminathan
McGraw-Hill Professional Publishing, 2007
299*2007
Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates
SK Bhattacharya, RR Tummala
Journal of Materials Science: Materials in Electronics 11, 253-268, 2000
2972000
Wearable systems for health care applications
P Lukowicz, T Kirstein, G Tröster
Methods of information in medicine 43 (03), 232-238, 2004
2912004
RF-system-on-package (SOP) for wireless communications
K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ...
IEEE Microwave magazine 3 (1), 88-99, 2002
2592002
Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs
V Sukumaran, T Bandyopadhyay, V Sundaram, R Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (9 …, 2012
2372012
Microelectronics Packaging Handbook: Technology Drivers Part I
RR Tummala, EJ Rymaszewski, AG Klopfenstein
Springer Science & Business Media, 2012
2272012
Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV)
X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman
2009 59th Electronic components and technology conference, 624-629, 2009
2172009
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
1862004
Carrier density and Schottky barrier on the performance of DC nanogenerator
J Liu, P Fei, J Song, X Wang, C Lao, R Tummala, ZL Wang
Nano letters 8 (1), 328-332, 2008
1792008
System on chip or system on package?
RR Tummala, VK Madisetti
IEEE Design & Test of Computers 16 (2), 48-56, 1999
1731999
Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
AH Kumar, PW McMillan, RR Tummala
US Patent 4,301,324, 1981
1671981
A review of 5G front-end systems package integration
AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
1662020
Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors
SK Bhattacharya, RR Tummala
Microelectronics Journal 32 (1), 11-19, 2001
1652001
A novel integrated decoupling capacitor for MCM-L technology
P Chahal, RR Tummala, MG Allen, M Swaminathan
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
1611998
현재 시스템이 작동되지 않습니다. 나중에 다시 시도해 주세요.
학술자료 1–20