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Prof. Amelie Hagelauer
Prof. Amelie Hagelauer
Lehrstuhl für Mikro- und Nanosystemtechnik, Technische Universität München
Verified email at tum.de
Title
Cited by
Cited by
Year
Microwave acoustic wave devices: Recent advances on architectures, modeling, materials, and packaging
A Hagelauer, G Fattinger, CCW Ruppel, M Ueda, K Hashimoto, A Tag
IEEE Transactions on Microwave Theory and Techniques 66 (10), 4548-4562, 2018
1072018
Integrated systems-in-package: heterogeneous integration of millimeter-wave active circuits and passives in fan-out wafer-level packaging technologies
A Hagelauer, M Wojnowski, K Pressel, R Weigel, D Kissinger
IEEE Microwave Magazine 19 (1), 48-56, 2017
462017
Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology
C Beck, H Ng, R Agethen, M PourMousavi, H Forstner, M Wojnowski, ...
IEEE, 2016
442016
Conditional capacity and transmit signal design for SWIPT systems with multiple nonlinear energy harvesting receivers
R Morsi, V Jamali, A Hagelauer, DWK Ng, R Schober
IEEE Transactions on Communications 68 (1), 582-601, 2019
412019
From Microwave Acoustic Filters to Millimeter-Wave Operation and New Applications
A Hagelauer, R Ruby, S Inoue, V Plessky, KY Hashimoto, R Nakagawa, ...
IEEE Journal of Microwaves, 2022
362022
Design of a Novel Quarter-Mode Substrate-Integrated Waveguide Filter With Multiple Transmission Zeros and Higher Mode Suppressions
XL Huang, L Zhou, M Völkel, A Hagelauer, JF Mao, R Weigel
IEEE Transactions on Microwave Theory and Techniques 66 (12), 5573-5584, 2018
312018
A Quad-Core 60 GHz Push-Push 45 nm SOI CMOS VCO with− 101.7 dBc/Hz Phase Noise at 1 MHz offset, 19% Continuous FTR and− 187 dBc/Hz FoMT
J Rimmelspacher, R Weigel, A Hagelauer, V Issakov
ESSCIRC 2018-IEEE 44th European Solid State Circuits Conference (ESSCIRC …, 2018
212018
A 1.8-mW low power, PVT-resilient, high linearity, modified Gilbert-cell down-conversion mixer in 28-nm CMOS
R Ciocoveanu, J Rimmelspacher, R Weigel, A Hagelauer, V Issakov
2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018
212018
Enhancing RF Bulk Acoustic Wave Devices: Multiphysical Modeling and Performance
V Chauhan, C Huck, A Frank, W Akstaller, R Weigel, A Hagelauer
IEEE Microwave Magazine 20 (10), 56-70, 2019
202019
A method for accurate modeling of BAW filters at high power levels
A Tag, V Chauhan, C Huck, B Bader, D Karolewski, FM Pitschi, R Weigel, ...
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 63 …, 2016
192016
Impact Of High Sc Content On Crystal Morphology And RF Performance Of Sputtered Al1-xScxN SMR BAW
A Bogner, HJ Timme, R Bauder, A Mutzbauer, D Pichler, M Krenzer, ...
2019 IEEE International Ultrasonics Symposium (IUS), 706-709, 2019
162019
36% Frequency-tuning-range dual-core 60 GHz push-push VCO in 45 nm RF-SOI CMOS technology
J Rimmelspacher, R Weigel, A Hagelauer, V Issakov
2017 IEEE MTT-S International Microwave Symposium (IMS), 1356-1358, 2017
162017
Influence of temperature distribution on behavior, modeling, and reliability of BAW resonators
A Tag, R Weigel, A Hagelauer, B Bader, C Huck, M Pitschi, K Wagner, ...
2014 IEEE International Reliability Physics Symposium, 5C. 5.1-5C. 5.7, 2014
162014
3D rectangular waveguide integrated in embedded wafer level ball grid array (eWLB) package
E Seler, M Wojnowski, W Hartner, J Böck, R Lachner, R Weigel, ...
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 956-962, 2014
162014
SAW and CMOS RFID transponder-based wireless systems and their applications
A Hagelauer, T Ussmueller, R Weigel
2012 IEEE International Frequency Control Symposium Proceedings, 1-6, 2012
162012
Investigation on Third-Order Intermodulation Distortions Due to Material Nonlinearities in TC-SAW Devices
V Chauhan, M Mayer, E Mayer, W Ruile, T Ebner, I Bleyl, KC Wagner, ...
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 65 …, 2018
152018
Co-simulation and co-design of chip-package-board interfaces in highly-integrated RF systems
V Issakov, M Wojnowski, H Knapp, S Trotta, HP Forstner, K Pressel, ...
2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 94-101, 2016
152016
Influence of dissipated power distribution on BAW resonators' behavior
A Tag, R Weigel, A Hagelauer, B Bader, C Huck, M Pitschi, D Karolewski
2014 IEEE International Ultrasonics Symposium, 2627-2630, 2014
152014
Enhanced Piezoelectric AL1− XSCXN RF-MEMS Resonators for Sub-6 GHz RF-Filter Applications: Design, Fabrication and Characterization
A Bogner, R Bauder, HJ Timme, T Forster, C Reccius, R Weigel, ...
142020
A low-power wideband D-band LNA in a 130 nm BiCMOS technology for imaging applications
E Aguilar, A Hagelauer, D Kissinger, R Weigel
2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018
142018
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