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Co-authors
Xingde Li, PhDDepartment of Biomedical Engineering, Johns Hopkins UniversityVerified email at jhu.edu
Wu Yuan,PhDAssistant Professor in Department of Biomedical Engineering, the Chinese University of Hong Kong.Verified email at cuhk.edu.hk
Ki-Hun Jeong 정기훈Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST)Verified email at kaist.ac.kr
Yeong-Hyeon SeoSamsung Electronics, DX, Global Technology Research (GTR)Verified email at samsung.com
Dawei LiPeking UniversityVerified email at pku.edu.cn
Defu Chen 陈德福Assistant Professor in School of Medical Technology, Beijing Institute of TechnologyVerified email at jhmi.edu
Cheol SongDGISTVerified email at dgist.ac.kr
Jessica MavadiaJohns Hopkins UniversityVerified email at jhmi.edu
Lonny YarmusJohns Hopkins UniversityVerified email at jhmi.edu
Xinwen Yao 姚昕文Applied Materials Singapore Pte LtdVerified email at ntu.edu.sg
Minseok KangCzech Adademy of SciencesVerified email at iem.cas.cz
Huikai XieProfessor of Microelectronics and MEMS, Beijing Institute of TechnologyVerified email at bit.edu.cn
Xiaoyang ZhangDisplay Engineer, Apple Inc.Verified email at ufl.edu
Seung Zhoo YoonProfessor, Department of Anesthesiology, College of Medicine, Korea University, Seoul, KoreaVerified email at korea.ac.kr
Seung-Hwan BaekPOSTECHVerified email at postech.ac.kr
Kyung-Won JangKAISTVerified email at kaist.ac.kr
Milad AlemohammadJohns Hopkins UniversityVerified email at jhu.edu
Yong JeongProfessor, Bio and Brain Engineering, KAISTVerified email at kaist.ac.kr
Sang-Gil ParkGauss Labs