| A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits A Bojita, C Boianceanu, M Purcar, C Florea, D Simon, CS Plesa Microelectronics Reliability 87, 142-150, 2018 | 13 | 2018 |
| Efficient computational methodology of thermo-mechanical phenomena in the metal system of power ICs A Bojita, M Purcar, C Boianceanu, V Topa 2019 25th International Workshop on Thermal Investigations of ICs and …, 2019 | 9 | 2019 |
| A study of adaptive mesh refinement techniques for an efficient capture of the thermo-mechanical phenomena in power integrated circuits A Bojita, M Purcar, C Boianceanu, E Tomas, V Topa 2017 International Semiconductor Conference (CAS), 205-208, 2017 | 8 | 2017 |
| A Novel Multi-Scale Method for Thermo-Mechanical Simulation of Power Integrated Circuits A Bojita, M Purcar, D Simon, C Florea, C Boianceanu, V Topa IEEE Journal of the Electron Devices Society 10, 169-179, 2022 | 5 | 2022 |
| Numerical analysis of electro-thermal behavior and optimization of the cooling system in electronic power devices using CAD/CAE tools A Avram, A Bojiţă, M Purcar, C Munteanu 2017 International Conference on Modern Power Systems (MPS), 1-4, 2017 | 3 | 2017 |
| Project-oriented approach in teaching programming to the first year undergraduate students in Electrical Engineering L Grindei, C Constantinescu, A Bojita, R Holonec, L Rapolti 2023 10th International Conference on Modern Power Systems (MPS), 1-4, 2023 | 2 | 2023 |
| A Simple Metal-Semiconductor Substructure Model for the Thermal Induced Fatigue Simulation in Power Integrated Circuits A Bojita, M Purcar, C Boianceanu, C Florea, D Simon, V Topa Proceedings of the 1st International Conference on Numerical Modelling in …, 2019 | 2 | 2019 |
| Chip structure metallization impact on thermally induced faults in power IC devices L Dobre, A Bojita, M Purcar, V Topa, C Munteanu 2021 9th International Conference on Modern Power Systems (MPS), 1-4, 2021 | 1 | 2021 |
| Thermo-mechanical simulation of the metal-semiconductor structures of power integrated circuits A Bojita, A Avram, M Purcar, C Munteanu, V Topa 2017 International Conference on Modern Power Systems (MPS), 1-6, 2017 | 1 | 2017 |
| Software Program for the Evaluation of Human Exposure to Electric and Magnetic Fields A Giurgiuman, M Gliga, A Bojita, S Andreica, C Munteanu, V Topa, ... Technologies 11 (6), 159, 2023 | | 2023 |
| Study on Non-Conformal Mesh Approach Applied on Layered Microelectronic Structure L Dobre, A Bojita, M Purcar, D Tscharnuter, M Petersmann 2023 10th International Conference on Modern Power Systems (MPS), 1-4, 2023 | | 2023 |
| Test Structure Design for Defect Detection during Active Thermal Cycling C Florea, D Simon, A Bojiță, M Purcar, C Boianceanu, V Țopa Sensors 22 (19), 7223, 2022 | | 2022 |
| A Simplified Model for Approximating the Vias in the Thermo-Mechanical Simulation of Metal-Oxide-Semiconductor Structures A Bojita, M Purcar, V Topa, C Munteanu 2019 8th International Conference on Modern Power Systems (MPS), 1-4, 2019 | | 2019 |
| A two layer ground computational model for the numerical simulations of the earthing systems M Purcar, C Munteanu, A Avram, A Bojita 2016 International Conference and Exposition on Electrical and Power …, 2016 | | 2016 |
