| Effects of tool electrode on EDM performance of Ti-6Al-4V Rahul, DK Mishra, S Datta, M Masanta Silicon 10, 2263-2277, 2018 | 83 | 2018 |
| Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit Journal of Materials Processing Technology 271, 542-553, 2019 | 73 | 2019 |
| Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining DK Mishra, AK Verma, J Arab, D Marla, P Dixit Journal of Micromechanics and Microengineering 29 (7), 075004, 2019 | 46 | 2019 |
| High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique DK Mishra, J Arab, Y Magar, P Dixit ECS Journal of Solid State Science and Technology 8 (6), P322, 2019 | 39 | 2019 |
| Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining SK Patro, DK Mishra, J Arab, P Dixit Journal of Applied Electrochemistry 50, 169-184, 2020 | 32 | 2020 |
| Micro array hole formation in glass using electrochemical discharge machining J Arab, P Adhale, DK Mishra, P Dixit Procedia Manufacturing 34, 349-354, 2019 | 28 | 2019 |
| Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling J Arab, DK Mishra, P Dixit Measurement 168, 108463, 2021 | 27 | 2021 |
| Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications VK Bajpai, DK Mishra, P Dixit Applied Surface Science 584, 152494, 2022 | 24 | 2022 |
| Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications AK Verma, DK Mishra, K Pawar, P Dixit Microsystem Technologies 26, 2105-2116, 2020 | 22 | 2020 |
| Effect of Tool Electrode-Workpiece Gap in the Microchannel Formation by Electrochemical Discharge Machining DK Mishra, K Pawar, P Dixit ECS Journal of Solid State Science and Technology 9 (3), 034011, 2020 | 20 | 2020 |
| Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process DK Mishra, P Dixit Journal of Manufacturing Processes 72, 93-104, 2021 | 19 | 2021 |
| Through hole making by electro-discharge machining on Inconel 625 super alloy using hollow copper tool electrode DK Mishra, ▪ Rahul, S Datta, M Masanta, SS Mahapatra Proceedings of the Institution of Mechanical Engineers, Part E: Journal of …, 2019 | 19 | 2019 |
| Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process P Sharma, DK Mishra, P Dixit Procedia Manufacturing 48, 244-250, 2020 | 18 | 2020 |
| Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process T Singh, DK Mishra, P Dixit Journal of Applied Electrochemistry 52 (4), 667-682, 2022 | 13 | 2022 |
| Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining J Arab, DK Mishra, P Dixit Procedia Manufacturing 48, 492-497, 2020 | 13 | 2020 |
| Multi-Response Optimization during Electro-Discharge Machining of Super Alloy Inconel 718: Application of PCA-TOPSIS A Srivastava, DK Mishra, S Chatterjee, S Datta, BB Biswal, SS Mahapatra | 13 | 2017 |
| Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications DK Mishra, T Singh, P Dixit Materials and Manufacturing Processes 37 (12), 1463-1473, 2022 | 11 | 2022 |
| Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications DK Mishra, J Arab, K Pawar, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 263-266, 2019 | 11 | 2019 |
| Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020 | 10 | 2020 |
| Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding VN Sekhar, MD Kumar, P Lianto, SC Chong, VS Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 564-570, 2023 | 9 | 2023 |
Pradeep DixitIIT Bombay India, NTU Singapore, VTT Finlandiitb.ac.in의 이메일 확인됨
