PolyMUMPs MEMS device to measure mechanical stiffness of single cells in aqueous media S Warnat, H King, C Forbrigger, T Hubbard Journal of Micromechanics and Microengineering 25 (2), 025011, 2015 | 26 | 2015 |
Investigation of key technologies for system-in-package integration of inertial MEMS N Marenco, W Reinert, S Warnat, P Lange, S Gruenzig, G Allegato, ... 2009 Symposium on design, test, integration & packaging of MEMS/MOEMS, 35-40, 2009 | 20 | 2009 |
Value-added composite bioproducts reinforced with regionally significant agricultural residues MA Solle, J Arroyo, MH Burgess, S Warnat, CA Ryan Composites Part A: Applied Science and Manufacturing 124, 105441, 2019 | 19 | 2019 |
Improvements in methods for measuring the volume conductivity of electrically conductive carbon powders S Kane, S Warnat, C Ryan Advanced Powder Technology 32 (3), 702-709, 2021 | 17 | 2021 |
MEMS squeezer for the measurement of single cell rupture force, stiffness change, and hysteresis B Barazani, S Warnat, A Fine, T Hubbard Journal of Micromechanics and Microengineering 27 (2), 025002, 2016 | 16 | 2016 |
Simulation and optical measurement of MEMS thermal actuator sub-micron displacements in air and water B Barazani, S Warnat, T Hubbard 2015 IEEE 28th Canadian Conference on Electrical and Computer Engineering …, 2015 | 13 | 2015 |
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads T Fałat, K Friedel, N Marenco, S Warnat Microsystem Technologies 15, 181-190, 2009 | 13 | 2009 |
Mitigation and use of biofilms in space for the benefit of human space exploration YAV Justiniano, DM Goeres, EL Sandvik, BV Kjellerup, TA Sysoeva, ... Biofilm 5, 100102, 2023 | 11 | 2023 |
Vacuum encapsulation of resonant MEMS sensors by direct chip-to-wafer stacking on ASIC N Marenco, W Reinert, S Warnat, P Lange, S Gruenzig, G Hillmann, ... 2008 10th Electronics Packaging Technology Conference, 773-777, 2008 | 10 | 2008 |
Submicron displacement measurements of MEMS using optical microphotographs in aqueous media: Enhancement using color image processing S Warnat, H King, R Schwartz, M Kujath, T Hubbard MRS Online Proceedings Library (OPL) 1659, 43-48, 2014 | 9 | 2014 |
Direct integration of MEMS, dielectric pumping and cell manipulation with reversibly bonded gecko adhesive microfluidics S Warnat, H King, A Wasay, D Sameoto, T Hubbard Journal of Micromechanics and Microengineering 26 (9), 097001, 2016 | 8 | 2016 |
Characteristics of a micro-mechanical thermal flow sensor based on a two hot wires principle with constant temperature operation in a small channel P Lange, M Weiss, S Warnat Journal of Micromechanics and Microengineering 24 (12), 125005, 2014 | 8 | 2014 |
Interconnect challenges in highly integrated MEMS/ASIC subsystems N Marenco, S Warnat, W Reinert arXiv preprint arXiv:0802.3095, 2008 | 8 | 2008 |
Through silicon vias in micro-electromechanical systems S Warnat, R Ecke, N Marenco, S Gruenzig, W Reinert, P Lange | 7 | 2009 |
Using electrochemical impedance spectroscopy to study biofilm growth in a 3D-printed flow cell system M McGlennen, M Dieser, CM Foreman, S Warnat Biosensors and Bioelectronics: X 14, 100326, 2023 | 6 | 2023 |
Thermal MEMS actuator operation in aqueous media/seawater: Performance enhancement through atomic layer deposition post processing of PolyMUMPs devices S Warnat, C Forbrigger, T Hubbard, A Bertuch, G Sundaram Journal of Vacuum Science & Technology A 33 (1), 2015 | 6 | 2015 |
DAVID-A Strategic research project for Chip-Scale MEMS/ASIC Co-integration N Marenco, W Reinert, S Warnat | 5 | 2007 |
Microsensors in icy environments to detect microbial activities M McGlennen, M Neubauer, M Driesler, M Dieser, CM Foreman, S Warnat Journal of Microelectromechanical Systems 29 (5), 853-859, 2020 | 4 | 2020 |
3D printing on glass for direct sensor integration M Neubauer, M McGlennen, S Thomas, S Warnat Engineering Research Express 1 (2), 025051, 2019 | 4 | 2019 |
MEMS measurements of single cell stiffness decay due to cyclic mechanical loading B Barazani, S Warnat, AJ MacIntosh, T Hubbard Biomedical Microdevices 19, 1-11, 2017 | 4 | 2017 |