팔로우
Dr. Julfekar Arab
Dr. Julfekar Arab
Post-doctoral Researcher, The Chinese University of Hong Kong
cuhk.edu.hk의 이메일 확인됨
제목
인용
인용
연도
Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging
J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit
Journal of Materials Processing Technology 271, 542-553, 2019
722019
Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM
J Arab, HK Kannojia, P Dixit
Precision Engineering 60, 437-447, 2019
622019
Fabrication and characterization of through-glass vias by the ECDM process
HK Kannojia, J Arab, BJ Pegu, P Dixit
Journal of the Electrochemical Society 166 (13), D531, 2019
532019
Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining
DK Mishra, AK Verma, J Arab, D Marla, P Dixit
Journal of Micromechanics and Microengineering 29 (7), 075004, 2019
462019
Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate
J Arab, P Dixit
Materials and Manufacturing Processes 35 (15), 1749-1760, 2020
432020
High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique
DK Mishra, J Arab, Y Magar, P Dixit
ECS Journal of Solid State Science and Technology 8 (6), P322, 2019
392019
Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining
SK Patro, DK Mishra, J Arab, P Dixit
Journal of Applied Electrochemistry 50, 169-184, 2020
322020
Effect of tool-electrode material in through-hole formation using ECDM process
J Arab, K Pawar, P Dixit
Materials and Manufacturing Processes 36 (9), 1019-1027, 2021
302021
Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling
J Arab, DK Mishra, P Dixit
Measurement 168, 108463, 2020
272020
Micro array hole formation in glass using electrochemical discharge machining
J Arab, P Adhale, DK Mishra, P Dixit
Procedia Manufacturing 34, 349-354, 2019
262019
Through-holes micromachining of alumina using a combined pulse-feed approach in ECDM
P Sharma, J Arab, P Dixit
Materials and Manufacturing Processes 36 (13), 1501-1512, 2021
212021
A review on microholes formation in glass-based substrates by electrochemical discharge drilling for MEMS applications
T Singh, J Arab, P Dixit
Machining Science and Technology 26 (2), 276-337, 2022
202022
Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining
J Arab, P Dixit
Journal of Manufacturing Processes 78, 92-106, 2022
162022
Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining
J Arab, DK Mishra, P Dixit
Procedia Manufacturing 48, 492-497, 2020
122020
Fabrication of deep microfeatures in glass substrate using electrochemical discharge machining for biomedical and microfluidic applications
DK Mishra, J Arab, K Pawar, P Dixit
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 263-266, 2019
112019
Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process
HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020
102020
Electrochemical discharge machining of soda lime glass for MEMS applications
J Arab, HS Chauhan, P Dixit
International Journal of Precision Technology 8 (2-4), 220-236, 2019
92019
Gas bubbles entrapment mechanism in the electrochemical discharge machining involving multi-tip array electrodes
J Arab, P Dixit
Journal of Manufacturing Processes 99, 38-52, 2023
72023
Improvement on surface quality of Inconel-718 slits via laser cutting and wire electrochemical machining processes
T Singh, J Arab, SC Chen
Optics & Laser Technology 167, 109637, 2023
62023
Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining
HK Kannojia, J Arab, R Kumar, J Pednekar, P Dixit
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 253-257, 2019
42019
현재 시스템이 작동되지 않습니다. 나중에 다시 시도해 주세요.
학술자료 1–20