| Demystifying 3D ICs: The pros and cons of going vertical WR Davis, J Wilson, S Mick, J Xu, H Hua, C Mineo, AM Sule, M Steer, ... IEEE Design & Test of Computers 22 (6), 498-510, 2005 | 1261 | 2005 |
| Fine-grained DRAM: Energy-efficient DRAM for extreme bandwidth systems M O'Connor, N Chatterjee, D Lee, J Wilson, A Agrawal, SW Keckler, ... Proceedings of the 50th Annual IEEE/ACM International Symposium on …, 2017 | 207 | 2017 |
| 3 Gb/s AC coupled chip-to-chip communication using a low swing pulse receiver L Luo, JM Wilson, SE Mick, J Xu, L Zhang, PD Franzon IEEE Journal of Solid-State Circuits 41 (1), 287-296, 2005 | 131 | 2005 |
| 4 Gbps high-density AC coupled interconnection S Mick, J Wilson, P Franzon Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No …, 2002 | 130 | 2002 |
| A 4.3 GB/s mobile memory interface with power-efficient bandwidth scaling B Leibowitz, R Palmer, J Poulton, Y Frans, S Li, J Wilson, M Bucher, ... IEEE journal of solid-state circuits 45 (4), 889-898, 2010 | 112 | 2010 |
| A 0.54 pJ/b 20 Gb/s ground-referenced single-ended short-reach serial link in 28 nm CMOS for advanced packaging applications JW Poulton, WJ Dally, X Chen, JG Eyles, TH Greer, SG Tell, JM Wilson, ... IEEE Journal of Solid-State Circuits 48 (12), 3206-3218, 2013 | 104 | 2013 |
| Flexible, durable printed electrical circuits B Karaguzel, CR Merritt, T Kang, JM Wilson, HT Nagle, E Grant, ... The Journal of The Textile Institute 100 (1), 1-9, 2009 | 93 | 2009 |
| A 1.17-pJ/b, 25-Gb/s/pin ground-referenced single-ended serial link for off-and on-package communication using a process-and temperature-adaptive voltage regulator JW Poulton, JM Wilson, WJ Turner, B Zimmer, X Chen, SS Kudva, S Song, ... IEEE Journal of Solid-State Circuits 54 (1), 43-54, 2018 | 64 | 2018 |
| Method and apparatus for source-synchronous signaling JL Zerbe, BS Leibowitz, HJ Su, JC Eble III, BW Daly, L Luo, TJ Stone, ... US Patent 8,836,394, 2014 | 64 | 2014 |
| A 1.17 pJ/b 25Gb/s/pin ground-referenced single-ended serial link for off-and on-package communication in 16nm CMOS using a process-and temperature-adaptive voltage regulator JM Wilson, WJ Turner, JW Poulton, B Zimmer, X Chen, SS Kudva, S Song, ... 2018 IEEE International Solid-State Circuits Conference-(ISSCC), 276-278, 2018 | 45 | 2018 |
| On-chip regulator with variable load compensation BS Leibowitz, MD Bucher, L Luo, CC Huang, A Amirkhany, HM Nguyen, ... US Patent 9,046,909, 2015 | 44 | 2015 |
| Pseudo-differential vector signaling for noise reduction in single-ended signaling systems D Oh, A Abbasfar, L Luo, J Kim, R Schmitt, F Ware, J Wilson, C Yuan Proc. DesignCon 2009, 2009 | 44 | 2009 |
| AC coupled interconnect for dense 3-D ICs J Xu, S Mick, J Wilson, L Luo, K Chandrasekar, E Erickson, PD Franzon IEEE Transactions on Nuclear Science 51 (5), 2156-2160, 2004 | 43 | 2004 |
| Balanced on-die termination J Wilson, JH Kim, R Kollipara, D Secker, KS Oh US Patent 8,588,012, 2013 | 42 | 2013 |
| Study of signal and power integrity challenges in high-speed memory I/O designs using single-ended signaling schemes D Oh, W Kim, JH Kim, J Wilson, R Schmitt, C Yuan, L Luo, J Kizer, J Eble, ... Proc. DesignCon, 1-23, 2008 | 41 | 2008 |
| Sensors on textile substrates for home-based healthcare monitoring TH Kang, C Merritt, B Karaguzel, J Wilson, P Franzon, B Pourdeyhimi, ... 1st Transdisciplinary Conference on Distributed Diagnosis and Home …, 2006 | 41 | 2006 |
| Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks B Karaguzel, CR Merritt, T Kang, JM Wilson, HT Nagle, E Grant, ... Journal of the Textile Institute 99 (1), 37-45, 2008 | 39 | 2008 |
| 2.8 Gb/s inductively coupled interconnect for 3D ICs J Xu, J Wilson, S Mick, L Luo, P Franzon Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005., 352-355, 2005 | 39 | 2005 |
| A 32-Gb/s on-chip bus with driver pre-emphasis signaling L Zhang, JM Wilson, R Bashirullah, L Luo, J Xu, PD Franzon IEEE transactions on very large scale integration (VLSI) systems 17 (9 …, 2009 | 36 | 2009 |
| Ground-referenced signaling for intra-chip and short-reach chip-to-chip interconnects WJ Turner, JW Poulton, JM Wilson, X Chen, SG Tell, M Fojtik, TH Greer, ... 2018 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2018 | 35 | 2018 |
Paul FranzonProfessor of Electrical and Computer Engineering, North Carolina State UniversityVerified email at ncsu.edu
