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Co-authors
- Terrence ChenUII America, Inc.Verified email at uii-ai.com
- Vivek Kumar SinghSiemens HealthineersVerified email at siemens-healthineers.com
- Tsuhan ChenNational University of SingaporeVerified email at nus.edu.sg
- Kai MaTencentVerified email at tencent.com
- Stefan KlucknerSiemens Mobility, Technology and InnovationVerified email at kluckner.com
- Chia-Wen Lin (林嘉文)Distinguished Professor of Electrical Engineering, National Tsing Hua University, TaiwanVerified email at ee.nthu.edu.tw
- Ankur KapoorSiemens HealthineerVerified email at siemens.com
- Ching-Chun HuangNational Yang Ming Chiao Tung UniversityVerified email at nycu.edu.tw
- Zhaoyin JiaCornell UniversityVerified email at cornell.edu
- Michael WelsSiemens Healthcare GmbHVerified email at siemens.com
- Jiangping WangAI Research ScientistVerified email at siemens.com
- Adarsh KowdleSenior Staff Software Engineer and Manager, Google.Verified email at google.com
- Andrew GallagherSoftware Engineer, GoogleVerified email at google.com
- Thomas O'DonnellSenior Key Expert, Siemens HealthineersVerified email at siemens-healthineers.com
- Franz FranchettiCarnegie Mellon UniversityVerified email at ece.cmu.edu
- Shanhui SunUII America, Inc.Verified email at uiowa.edu
- Dhruv BatraGeorgia Tech | Prev: FAIR (Meta AI)Verified email at gatech.edu
- Ming-Ting SunProfessor of Electrical Engineering, University of WashingtonVerified email at ee.washington.edu
- Tzunghan LinNational Taiwan University of Science and TechnologyVerified email at mail.ntust.edu.tw
- James C. HoeProfessor of Electrical and Computer Engineering, Carnegie Mellon UniversityVerified email at cmu.edu