| Investigation of the optical and electronic properties of Ge2Sb2Te5 phase change material in its amorphous, cubic, and hexagonal phases BS Lee, JR Abelson, SG Bishop, DH Kang, B Cheong, KB Kim Journal of Applied Physics 97 (9), 093509, 2005 | 778 | 2005 |
| Thermal conductivity of phase-change material Ge2Sb2Te5 HK Lyeo, DG Cahill, BS Lee, JR Abelson, MH Kwon, KB Kim, SG Bishop, ... Applied physics letters 89 (15), 151904-151904-3, 2006 | 390 | 2006 |
| Observation of the role of subcritical nuclei in crystallization of a glassy solid BS Lee, GW Burr, RM Shelby, S Raoux, CT Rettner, SN Bogle, ... Science 326 (5955), 980-984, 2009 | 221 | 2009 |
| Low-temperature processing of B4C–Al composites via infiltration technique BS Lee, S Kang Materials chemistry and physics 67 (1), 249-255, 2001 | 138 | 2001 |
| Large metal pads over TSV G Gao, LEE Bongsub, GG Fountain Jr, CE Uzoh, LW Mirkarimi, B Haba, ... US Patent 11,393,779, 2022 | 98 | 2022 |
| Bonded structures R Katkar, LW Mirkarimi, LEE Bongsub, GG Fountain Jr, CE Uzoh US Patent 11,004,757, 2021 | 88 | 2021 |
| Nanoscale nuclei in phase change materials: Origin of different crystallization mechanisms of Ge2Sb2Te5 and AgInSbTe BS Lee, RM Shelby, S Raoux, CT Retter, GW Burr, SN Bogle, ... Journal of Applied Physics 115 (6), 063506, 2014 | 84 | 2014 |
| Observation and modeling of polycrystalline grain formation in Ge2Sb2Te5 GW Burr, P Tchoulfian, T Topuria, C Nyffeler, K Virwani, A Padilla, ... Journal of Applied Physics 111 (10), 104308, 2012 | 80 | 2012 |
| Electronic, optical and thermal properties of the hexagonal and rocksalt-like Ge2Sb2Te5 chalcogenide from first-principle calculations T Tsafack, E Piccinini, BS Lee, E Pop, M Rudan Journal of Applied Physics 110 (6), 063716, 2011 | 74 | 2011 |
| Nanometer-scale order in amorphous Ge2Sb2Te5 analyzed by fluctuation electron microscopy MH Kwon, BS Lee, SN Bogle, LN Nittala, SG Bishop, JR Abelson, ... Applied physics letters 90, 021923, 2007 | 59 | 2007 |
| Offset pads over TSV LEE Bongsub, G Gao US Patent 10,998,292, 2021 | 56 | 2021 |
| STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS PACKAGING WITH INCREASED DENSITY CG Woychik, AR Sitaram, A Cao, B Lee US Patent 10,381,326 B2, 2019 | 54 | 2019 |
| Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding G Gao, L Mirkarimi, G Fountain, L Wang, C Uzoh, T Workman, G Guevara, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 314-322, 2018 | 52 | 2018 |
| Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding G Gao, L Mirkarimi, T Workman, G Fountain, J Theil, G Guevara, P Liu, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 628-635, 2019 | 51 | 2019 |
| Direct bond interconnect (DBI®) for fine-pitch bonding in 3D and 2.5 D integrated circuits L Wang, G Fountain, B Lee, G Gao, C Uzoh, S McGrath, P Enquist, ... 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2017 | 37 | 2017 |
| Distribution of nanoscale nuclei in the amorphous dome of a phase change random access memory BS Lee, K Darmawikarta, S Raoux, YH Shih, Y Zhu, SG Bishop, ... Applied Physics Letters 104 (7), 071907, 2014 | 37 | 2014 |
| Die to Wafer Stacking with Low Temperature Hybrid Bonding G Gao, T Workman, C Uzoh, KM Bang, L Mirkarimi, J Theil, D Suwito, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 589-594, 2020 | 34 | 2020 |
| Sequences and equipment for direct bonding LEE Bongsub, R Katkar US Patent App. 17/816,332, 2023 | 31 | 2023 |
| Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment G Gao, L Mirkarimi, T Workman, G Guevara, J Theil, C Uzoh, G Fountain, ... 2018 International Wafer Level Packaging Conference (IWLPC), 1-7, 2018 | 28 | 2018 |
| Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study G Gao, T Workman, L Mirkarimi, G Fountain, J Theil, G Guevara, C Uzoh, ... 2019 International Wafer Level Packaging Conference (IWLPC), 1-9, 2019 | 27 | 2019 |
