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Daniel Josell
Daniel Josell
Verified email at nist.gov
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Cited by
Cited by
Year
Superconformal electrodeposition of copper in 500–90 nm features
TP Moffat, JE Bonevich, WH Huber, A Stanishevsky, DR Kelly, GR Stafford, ...
Journal of The Electrochemical Society 147 (12), 4524, 2000
5562000
Superconformal film growth: Mechanism and quantification
TP Moffat, D Wheeler, MD Edelstein, D Josell
IBM Journal of Research and Development 49 (1), 19-36, 2005
4252005
Superconformal electrodeposition of copper
TP Moffat, D Wheeler, WH Huber, D Josell
Electrochemical and Solid-State Letters 4 (4), C26, 2001
4102001
Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS
TP Moffat, D Wheeler, D Josell
Journal of The Electrochemical Society 151 (4), C262, 2004
3672004
Size-dependent resistivity in nanoscale interconnects
D Josell, SH Brongersma, Z Tőkei
Annual Review of Materials Research 39, 231-254, 2009
2322009
Superconformal electrodeposition in submicron features
D Josell, D Wheeler, WH Huber, TP Moffat
Physical Review Letters 87 (1), 016102, 2001
2242001
Extreme bottom-up superfilling of through-silicon-vias by damascene processing: suppressor disruption, positive feedback and turing patterns
TP Moffat, D Josell
Journal of The Electrochemical Society 159 (4), D208, 2012
1992012
Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers
D Josell, D Wheeler, C Witt, TP Moffat
Electrochemical and solid-state letters 6 (10), C143, 2003
1872003
A simple equation for predicting superconformal electrodeposition in submicrometer trenches
D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat
Journal of the Electrochemical Society 148 (12), C767, 2001
1802001
Modeling superconformal electrodeposition using the level set method
D Wheeler, D Josell, TP Moffat
Journal of The Electrochemical Society 150 (5), C302, 2003
1612003
Curvature enhanced adsorbate coverage model for electrodeposition
TP Moffat, D Wheeler, SK Kim, D Josell
Journal of the Electrochemical Society 153 (2), C127, 2006
1522006
Electrodeposition of Cu on Ru barrier layers for damascene processing
TP Moffat, M Walker, PJ Chen, JE Bonevich, WF Egelhoff, L Richter, C Witt, ...
Journal of the Electrochemical Society 153 (1), C37, 2005
1522005
A new method for tensile testing of thin films
JA Ruud, D Josell, F Spaepen, AL Greer
Journal of Materials Research 8 (1), 112-117, 1993
1521993
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
TP Moffat, D Wheeler, SK Kim, D Josell
Electrochimica Acta 53 (1), 145-154, 2007
1462007
Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system: reduction of overfill bump formation during superfilling
SK Kim, D Josell, TP Moffat
Journal of The Electrochemical Society 153 (9), C616, 2006
1462006
Modeling extreme bottom-up filling of through silicon vias
D Josell, D Wheeler, TP Moffat
Journal of the Electrochemical Society 159 (10), D570, 2012
1052012
Cationic surfactants for the control of overfill bumps in Cu superfilling
SK Kim, D Josell, TP Moffat
Journal of The Electrochemical Society 153 (12), C826, 2006
1052006
Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries
AC Lewis, D Josell, TP Weihs
Scripta Materialia 48 (8), 1079-1085, 2003
1022003
The formation of FCC titanium in titanium-aluminum multilayers
D Van Heerden, D Josell, D Shechtman
Acta materialia 44 (1), 297-306, 1996
861996
Accelerator aging effects during copper electrodeposition
TP Moffat, B Baker, D Wheeler, D Josell
Electrochemical and solid-state letters 6 (4), C59, 2003
822003
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