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Padmanabh Pundrikaksha Pancham
Padmanabh Pundrikaksha Pancham
Verified email at gapp.nthu.edu.tw
Title
Cited by
Cited by
Year
Polymer matrix composite engineering for PDMS based capacitive sensors to achieve high-performance and broad-range pressure sensing
AR Tripathy, A Choudhury, A Dash, P Panigrahi, SS Kumar, PP Pancham, ...
Applied Surface Science Advances 3, 100062, 2021
172021
Recent advances in flexible force sensors and their applications: A review
YW Chen, PP Pancham, A Mukherjee, E Martincic, CY Lo
Flexible and Printed Electronics 7 (3), 033002, 2022
102022
Strain Visualization in Flexible Sensors with Functional Materials: A Review
PP Pancham, WH Chiu, A Mukherjee, CY Lo
Advanced Materials Interfaces 10 (14), 2300029, 2023
82023
Flexible BSA MIM capacitor with negative voltage coefficient for RF applications
P Kumar, S Guhathakurata, A Choudhury, A Sharma, AR Tripathy, ...
Applied Physics Letters 116 (17), 2020
72020
Novel graphene transfer method to silicone and its sensing application on porous PDMS
PP Pancham, A Mukherjee, BL Yuan, P Yu, WH Chiu, G Ahmad, S Mallik, ...
IEEE Sensors Letters, 2023
32023
Electromagnetic characteristic estimation on spiral antennas through AOI, ML, and AI
MJ Wu, MC Chang, CC Chung, PP Pancham, TJ Yen, CY Lo
Flexible and Printed Electronics 7 (2), 025012, 2022
22022
A sustainable industrial Silicone based substrate as well as circular platform to drive FHE manufacturing and supply chain for wearable, e-skin applications
A Mukherjee, PP Pancham, HY Yang
2021 IEEE International Flexible Electronics Technology Conference (IFETC …, 2021
22021
Optoelectronic device
CY Lo, PP PANCHAM, Z Yu-Xin, CL Pan
US Patent App. 18/302,157, 2024
2024
Thermoresistive Profile Sensing Based on Isotropic Strain Detection with Taiji Pattern Routing
YR Yang, TC Liu, YW Chen, PP Pancham, G Ahmad, S Mallik, CY Lo
IEEE Sensors Journal, 2024
2024
2-D Modelling of Fan-Out Panel Level Package and its Warpage Suppression Solution
SP Singh, PP Pancham, CY Lo
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 53-56, 2023
2023
Functional Composite Silicone Made by Roll-to-Roll Manufacturing for Sensing Applications and Circular Economy
PP Pancham, A Mukherjee, BL Yuan, P Yu, G Ahmad, S Mallik, CY Lo
2023 IEEE International Flexible Electronics Technology Conference (IFETC), 1-3, 2023
2023
Capacitive Tactile Sensor with Stacked Structure and Hybrid Fabrication for Multiaxial Force Decoupling
JY Wu, PP Pancham, TY Hsu, A Mukherjee, CY Lo
2022 IEEE Sensors, 1-3, 2022
2022
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