SUSMRITI DAS MAHAPATRA

Cited by

	All	Since 2019
Citations	379	367
h-index	5	5
i10-index	2	2

160

120

201720182019202020212022202320244 6 3 13 27 82 159 82

Public access

View all

7 articles

0 articles

available

not available

Based on funding mandates

Co-authors

Indranath DuttaWashington State UniversityVerified email at wsu.edu
Vijay K ThakurChemistry I Polymer Science I Materials Science IVerified email at sruc.ac.uk
Adrianus Indrat AriaCranfield UniversityVerified email at cranfield.ac.uk
Graham ChristieUniversity Senior Lecturer, University of CambridgeVerified email at cam.ac.uk
Stephan HofmannProfessor of Nanotechnology, University of Cambridge, UKVerified email at cam.ac.uk
Yogendra Kumar Mishra, Ph.D. Dr. ha...Professor-Smart Materials, Mads Clausen Institute, University of Southern DenmarkVerified email at mci.sdu.dk
Preetam Chandan MohapatraSenior Packaging R&D Engineer, Intel CorporationVerified email at intel.com
B.S. MajumdarNew Mexico TechVerified email at nmt.edu
Narjes FredjNAVAIRVerified email at navy.mil
Hanry YangProcess Engineer, Keysight TechnologiesVerified email at keysight.com
Soumik BanerjeeAssociate Professor of Mechanical and Materials Engineering, Washington State UniversityVerified email at wsu.edu
Amitesh SahaIntel Corporation, University of Rhode IslandVerified email at my.uri.edu
Malavarayan SankarasubramanianApple IncVerified email at apple.com

SUSMRITI DAS MAHAPATRA

Quality & Reliability R&D Engineer, Intel Corporation

Verified email at intel.com - Homepage

Semiconductor packaging microelectronics reliability piezoelectric materials tin whiskers thermal interface materials


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Piezoelectric materials for energy harvesting and sensing applications: Roadmap for future smart materials SD Mahapatra, PC Mohapatra, AI Aria, G Christie, YK Mishra, S Hofmann, ... Advanced Science 8 (17), 2100864, 2021	325	2021
Recent advances in mitigation of whiskers from electroplated tin BS Majumdar, I Dutta, S Bhassyvasantha, S Das Mahapatra JOM 72, 906-917, 2020	10	2020
Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth SD Mahapatra, I Dutta Surface and Coatings Technology 337, 478-483, 2018	9	2018
Elimination of whisker growth by indium addition in electroplated tin on copper substrate SD Mahapatra Washington State University, 2017	9	2017
Whisker mitigation mechanisms in indium-doped tin thin films: role of the surface S Bhassyvasantha, N Fredj, SD Mahapatra, W Jennings, I Dutta, ... Journal of Electronic Materials 47, 6229-6240, 2018	6	2018
Role of surface oxide in mitigating tin whisker growth: A finite element study SD Mahapatra, I Dutta Materials Science and Engineering: A 706, 181-191, 2017	5	2017
Eliminating whisker growth by indium addition in electroplated Sn on copper substrate S Das Mahapatra, BS Majumdar, I Dutta, S Bhassyvasantha Journal of Electronic Materials 46, 4062-4075, 2017	4	2017
Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin in Electronic Packages BSMID S. Das Mahapatra 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2017	4	2017
Influence of Indium Addition on Whisker Growth in Electroplated Sn ID S. Das Mahapatra, H. Yang, L. Meinshausen, S. Bhassyvasantha, S Banerjee ... The Ninth Pacific Rim International Conference on Advanced Materials and …, 2016	4*	2016
Chip-scale package architectures containing a die back side metal and a solder thermal interface material SD Mahapatra, M Sankarasubramanian, S Howell, J Harper, M Modi US Patent App. 17/033,080, 2022	1	2022
Solder Thermal Interface Material (STIM) with Dopant PL Susmriti Das Mahapatra, Bamidele Falola, Amitesh Saha, Sergio Chan US Patent App. 16/406,593, 2019	1*	2019
Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte I Dutta, SD Mahapatra US Patent App. 15/654,291, 2017	1	2017
Controlling tin whisker growth via oxygen-mediated decomposition of Ti₂SnC H Tang, B Yan, P Zhang, X Yin, Z Tian, S Das Mahapatra, W Zheng, ... Journal of Materials Science, 1-10, 2024		2024
Lids for Integrated Circuit Packages with Solder Thermal Interface Materials PL Bamidele Falola, Susmriti Das Mahapatra, Amitesh Saha, Sergio Chan US Patent App. 16/435,355, 2019		2019

The system can't perform the operation now. Try again later.

Articles 1–14

Citations per year

Duplicate citations

Merged citations

Add co-authorsCo-authors

Follow

Cited by

Co-authors