| Advances in wirelessly powered backscatter communications: From antenna/RF circuitry design to printed flexible electronics C Song, Y Ding, A Eid, JGD Hester, X He, R Bahr, A Georgiadis, ... Proceedings of the IEEE 110 (1), 171-192, 2021 | 54 | 2021 |
| Additively manufactured mm-wave multichip modules with fully printed “smart” encapsulation structures X He, BK Tehrani, R Bahr, W Su, MM Tentzeris IEEE Transactions on Microwave Theory and Techniques 68 (7), 2716-2724, 2019 | 42 | 2019 |
| A drone-based wireless power transfer anc communications platform X He, J Bito, MM Tentzeris 2017 IEEE Wireless Power Transfer Conference (WPTC), 1-4, 2017 | 39 | 2017 |
| Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications A Eid, X He, R Bahr, TH Lin, Y Cui, A Adeyeye, B Tehrani, MM Tentzeris IEEE Microwave Magazine 21 (12), 87-103, 2020 | 34 | 2020 |
| Zero-power sensors for smart objects: Novel zero-power additively manufactured wireless sensor modules for IoT applications J Kimionis, W Su, J Hester, J Bito, X He, TH Lin, MM Tentzeris IEEE Microwave Magazine 19 (6), 32-47, 2018 | 28 | 2018 |
| RFID based non-contact human activity detection exploiting cross polarization X He, J Zhu, W Su, MM Tentzeris IEEE Access 8, 46585-46595, 2020 | 20 | 2020 |
| A wideband, quasi-isotropic, kilometer-range FM energy harvester for perpetual IoT EM Jung, Y Cui, TH Lin, X He, A Eid, JGD Hester, GD Abowd, TE Starner, ... IEEE Microwave and Wireless Components Letters 30 (2), 201-204, 2019 | 18 | 2019 |
| Tile-based massively scalable MIMO and phased arrays for 5G/B5G-enabled smart skins and reconfigurable intelligent surfaces X He, Y Cui, MM Tentzeris Scientific Reports 12 (1), 2741, 2022 | 13 | 2022 |
| A fully 3d printed multi-chip module with an on-package enhanced dielectric lens for mm-wave applications using multimaterial stereo-lithography R Bahr, X He, B Tehrani, MM Tentzeris 2018 IEEE/MTT-S International Microwave Symposium-IMS, 1561-1564, 2018 | 13 | 2018 |
| In-package additively manufactured sensors for bend prediction and calibration of flexible phased arrays and flexible hybrid electronics X He, MM Tentzeris 2021 IEEE MTT-S International Microwave Symposium (IMS), 327-330, 2021 | 10 | 2021 |
| Fully inkjet printed 60GHz backscatter 5G RFID modules for sensing and localization in Internet of Things (IoT) and digital twins applications A Adeyeye, C Lynch, X He, S Lee, JD Cressler, MM Tentzeris 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1193-1198, 2021 | 10 | 2021 |
| RF systems on antenna (SoA): A novel integration approach enabled by additive manufacturing X He, Y Fang, RA Bahr, MM Tentzeris 2020 IEEE/MTT-S International Microwave Symposium (IMS), 1157-1160, 2020 | 10 | 2020 |
| Nanotechnology-enabled additively-manufactured RF and millimeter-wave electronics A Eid, B Tehrani, J Hester, H Xuanke, MM Tentzeris 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC), 1-4, 2018 | 8 | 2018 |
| Low-temperature assembly of surface-mount device on flexible substrate using additive printing process CL Taylor, X He, V Smet, MM Tentzeris, S Sitaraman 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 379-385, 2018 | 6 | 2018 |
| Additively manufactured “smart” rf/mm-wave packaging structures: A quantum leap for on-demand customizable integrated 5g and internet of things modules X He, K Hu, Y Cui, R Bahr, B Tehrani, MM Tentzeris IEEE Microwave Magazine 23 (8), 94-106, 2022 | 5 | 2022 |
| Flexible and scalable additively manufactured antenna array tiles for satellite and 5g applications using a novel rugged microstrip-to-microstrip transition K Hu, X He, MM Tentzeris 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI …, 2021 | 5 | 2021 |
| A 3D printed dish antenna with integrated feeding structure X He, MM Tentzeris 2020 IEEE International Symposium on Antennas and Propagation and North …, 2020 | 4 | 2020 |
| Additively manufactured RF devices for 5G, IoT, RFID, WSN, and smart city applications Y Cui, EM Jung, A Adeyeye, C Lynch, X He, M Tentzeris International Journal of High Speed Electronics and Systems 29 (01n04), 2040016, 2020 | 4 | 2020 |
| Integrating multiple energy harvesting systems for department of defense applications J Swanner, J Bito, G Nichols, X He, J Hewett, MM Tentzeris EESAT Conference-Evolution & Revolution, 2017 | 4 | 2017 |
| Coupled lines for wearable power dividers: Coupled transmission-line sections for power dividers in wearable and flexible RF electronics HR Ahn, MM Tentzeris, TH Lin, B Tehrani, X He IEEE Microwave Magazine 21 (2), 66-87, 2020 | 3 | 2020 |
