Current localisation and redistribution as the basis of discontinuous current controlled negative differential resistance in NbOx SK Nandi, SK Nath, AE Helou, S Li, X Liu, PE Raad, RG Elliman Advanced Functional Materials (2019), 2019 | 42 | 2019 |
Electric Field- and Current-Induced Electroforming Modes in NbOx SK Nandi, SK Nath, AE El-Helou, S Li, T Ratcliff, M Uenuma, PE Raad, ... ACS applied materials & interfaces 12 (7), 8422-8428, 2020 | 29 | 2020 |
High-resolution thermoreflectance imaging investigation of self-heating in AlGaN/GaN HEMTs on Si, SiC, and diamond substrates A El Helou, P Komarov, MJ Tadjer, TJ Anderson, DA Francis, T Feygelson, ... IEEE Transactions on Electron Devices 67 (12), 5415-5420, 2020 | 28 | 2020 |
Characterization of temperature rise in alternating current electrothermal flow using thermoreflectance method A Koklu, A El Helou, PE Raad, A Beskok Analytical chemistry 91 (19), 12492-12500, 2019 | 18 | 2019 |
Schottky-Barrier-Induced Asymmetry in the Negative-Differential-Resistance Response of / Cross-Point Devices SK Nath, SK Nandi, A El-Helou, X Liu, S Li, T Ratcliff, PE Raad, ... Physical Review Applied 13 (6), 064024, 2020 | 13 | 2020 |
Full thermal characterization of AlGaN/GaN high electron mobility transistors on silicon, silicon carbide, and diamond substrates using a reverse modeling approach A El-Helou, Y Cui, MJ Tadjer, TJ Anderson, D Francis, T Feygelson, ... Semiconductor Science and Technology 36 (1), 014008, 2020 | 8 | 2020 |
Thermal Conductivity of Amorphous NbOx Thin Films and Its Effect on Volatile Memristive Switching SK Nandi, SK Das, Y Cui, AE Helou, SK Nath, T Ratcliff, P Raad, ... ACS Applied Materials & Interfaces, 2022 | 5 | 2022 |
Coupled Experimental and Numerical Investigation of High-Voltage GaN HEMTs Y Cui, A El Helou, PE Raad ECS Transactions 89 (5), 11, 2019 | 5 | 2019 |
Thermal Modeling and Experimental Validation of Heat Sink Design for Passive Cooling of BEOL IC Structures A El Helou, PE Raad, D Kande, A Venugopal 24th InternatIonal Workshop on Thermal Investigations of ICs and Systems …, 2018 | 5 | 2018 |
Temperature dependence of the thermoreflectance coefficient of gold by the use of a phase-locked single-point measurement approach A El Helou, PE Raad, P Komarov 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2018 | 5 | 2018 |
Simple high-performance thermal management of chip-scale GaN FETs JS Glaser, A Helou, M Sharma, R Strittmatter, M de Rooij 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 44-49, 2021 | 4 | 2021 |
Standardized Heat Spreader Design for Passive Cooling of Interconnects in the BEOL of ICs A El Helou, A Venugopal, PE Raad IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020 | 4 | 2020 |
Thermal Characterization of Si BEOL Microelectronic Structures A El Helou, PE Raad, A Venugopal, D Kande ASME 2018 International Technical Conference and Exhibition on Packaging and …, 2018 | 4 | 2018 |
PCB Layout for Chip-Scale Package GaN Fets Optimizes Both Electrical and Thermal Performance J Glaser, A Helou, J Zhu, M de Rooij Applied Power Electronics Conference (APEC) 2022, 2022 | 2 | 2022 |
Quick Thermal Performance Estimation of Chip Scale Packaged GaN FETs using a Simple Circuit Model A El Helou, J Glaser, M Derooij 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2021 | 2 | 2021 |
Effects of Thermal Boundary Resistance on the Thermal Performance of GaN HEMT on Diamond A El Helou, M Tadjer, K Hobart, PE Raad 2020 IEEE International Reliability Physics Symposium (IRPS), 1-4, 2020 | 2 | 2020 |
Assessment of CMP fill pattern effect on the thermal performance of interconnects in integrated circuits BEOL A El Helou, A Venugopal, PE Raad 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 405-409, 2019 | 2 | 2019 |
Full 3D Thermal Simulation of GaN HEMT using Ultra-Fast Self-Adaptive Computations Driven by Experimentally Determined Thermal Maps A El Helou, MJ Tadjer, KD Hobart, PE Raad 24th InternatIonal Workshop on Thermal Investigations of ICs and Systems …, 2018 | 2 | 2018 |
Compact 3D thermal model for VLSI and ULSI interconnect network reliability verification A El Helou, A Venugopal, PE Raad IEEE Transactions on Device and Materials Reliability 21 (2), 240-251, 2021 | 1 | 2021 |
Current bifurcation induced conducting filament formation in NbOx SK Nandi, SK Nath, A El Helou, S Li, M Uenuma, PE Raad, RG Elliman arXiv preprint arXiv:1909.06443, 2019 | 1 | 2019 |