| Formation and Ripening of Self-Assembled Multilayers from the Vapor-Phase Deposition of Dodecanethiol on Copper Oxide DS Bergsman, TL Liu, RG Closser, KL Nardi, N Draeger, DM Hausmann, ... Chemistry of Materials 30 (16), 5694-5703, 2018 | 45 | 2018 |
| Area-Selective Atomic Layer Deposition on Chemically Similar Materials: Achieving Selectivity on Oxide/Oxide Patterns TL Liu, SF Bent Chemistry of Materials, 2021 | 40 | 2021 |
| Role of Precursor Choice on Area-Selective Atomic Layer Deposition IK Oh, TE Sandoval, TL Liu, NE Richey, SF Bent Chemistry of Materials 33 (11), 3926-3935, 2021 | 37 | 2021 |
| Effect of Multilayer versus Monolayer Dodecanethiol on Selectivity and Pattern Integrity in Area-Selective Atomic Layer Deposition TL Liu, KL Nardi, N Draeger, DM Hausmann, SF Bent ACS Applied Materials & Interfaces 12 (37), 42226-42235, 2020 | 32 | 2020 |
| Characterizing Self-Assembled Monolayer Breakdown in Area-Selective Atomic Layer Deposition TL Liu, L Zeng, KL Nardi, DM Hausmann, SF Bent Langmuir 37 (39), 11637-11645, 2021 | 21 | 2021 |
| Area-Selective Molecular Layer Deposition of a Silicon Oxycarbide Low-k Dielectric X Yu, D Bobb-Semple, IK Oh, TL Liu, RG Closser, W Trevillyan, SF Bent Chemistry of Materials 33 (3), 902-909, 2021 | 16 | 2021 |
| Elucidating the Reaction Mechanism of Atomic Layer Deposition of Al2O3 with a Series of Al(CH3)xCl3–x and Al(CyH2y+1)3 Precursors IK Oh, TE Sandoval, TL Liu, NE Richey, CT Nguyen, B Gu, HBR Lee, ... Journal of the American Chemical Society 144 (26), 11757-11766, 2022 | 10 | 2022 |
| Area-selective atomic layer deposition of dielectric-on-dielectric for Cu/low-k dielectric patterns TL Liu, SF Bent Advances in Patterning Materials and Processes XXXVI 10960, 109600O, 2019 | 8 | 2019 |
| A method to form self-aligned carbon-nanotube-vias using a Ta-cap layer on a Co-catalyst TL Liu, HW Wu, CY Wang, SY Chen, MH Hung, TR Yew Carbon 56, 366-373, 2013 | 7 | 2013 |
| Sequential Use of Orthogonal Self‐Assembled Monolayers for Area‐Selective Atomic Layer Deposition of Dielectric on Metal TL Liu, M Harake, SF Bent Advanced Materials Interfaces 10 (5), 2202134, 2023 | 5 | 2023 |
| Copper Oxidation Improves Dodecanethiol Blocking Ability in Area‐Selective Atomic Layer Deposition TL Liu, SF Bent Advanced Materials Interfaces 9 (19), 2200587, 2022 | 1 | 2022 |
| Investigating Area-Selective Atomic Layer Deposition of Dielectric on Diverse Substrate Systems TL Liu Stanford University, 2022 | | 2022 |
| Elucidating the Reaction Mechanism of Atomic Layer Deposition of Al₂O₃ with a Series of Al (CH₃) ₓCl₃–ₓ and Al (CyH₂y₊ ₁) ₃ Precursors IK Oh, TE Sandoval, TL Liu, NE Richey, CT Nguyen, B Gu, R Tonner-Zech, ... | | 2022 |
| (Invited) Area Selective Atomic Layer Deposition As an Emerging Process for Advanced Nanofabrication D Bobb-Semple, TL Liu, SF Bent 235th ECS Meeting (May 26-30, 2019), 2019 | | 2019 |
| Low Resistivity Tin-Doped Copper Nanowires CY Lin, CY Wang, MH Hung, TL Liu, TR Yew IEEE Electron Device Letters 34 (4), 529-531, 2013 | | 2013 |
