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Co-authors
- Satoshi IihamaNagoya UniversityVerified email at f.mail.nagoya-u.ac.jp
- Qinli MaHFC SemiconductorVerified email at hefechip.com
- Reza RanjbarFHR Anlagenbau GmbHVerified email at fhr.de
- Masafumi ShiraiResearch Institute of Electrical Communication, Tohoku UniversityVerified email at tohoku.ac.jp
- YUTA SASAKINational Institute for Materials ScienceVerified email at nims.go.jp
- Masaki MizuguchiNagoya UniversityVerified email at material.nagoya-u.ac.jp
- Atsufumi HirohataUniversity of YorkVerified email at york.ac.uk
- Jun OkabayashiThe University of TokyoVerified email at chem.s.u-tokyo.ac.jp
- Lakhan BainslaIIT Ropar, Earlier@UGOT/Chalmers(Sweden), UMN(USA), TU(Japan), IIT BombayVerified email at iitrpr.ac.in
- Yoshio MiuraNational Institute for Materials ScienceVerified email at nims.go.jp
- Akira KamimakiYokohama National UniversityVerified email at ynu.ac.jp
- Yoshishige SUZUKIOsaka UniversityVerified email at mp.es.osaka-u.ac.jp
- Gerhard H. FecherMax Planck Institute for Chemical Physics of SolidsVerified email at cpfs.mpg.de
- Masashi ShiraishiKyoto UniversityVerified email at kuee.kyoto-u.ac.jp
- Takayuki NozakiNational Institute of Industrial Science and TechnologyVerified email at aist.go.jp
- Yoichi ShiotaInstitute for Chemical Research, Kyoto UniversityVerified email at scl.kyoto-u.ac.jp
- Claudia FelserMax Planck Institute Chemical Physics of SolidsVerified email at cpfs.mpg.de
- Jakob WalowskiWisssenschaftlicher Assistent, Universitaet GreifswaldVerified email at uni-greifswald.de
- Hitoshi KubotaNational Institute of Industrial Science and Technology (AIST)Verified email at aist.go.jp
- TUFAN ROYTohoku UniversityVerified email at tohoku.ac.jp