| Investigation of thermal effects in copper chemical mechanical polishing P Liu, S Bae, S Hong, C Bae, H Seo, J Lee, C Tang, T Kim Precision Engineering 73, 195-202, 2022 | 12 | 2022 |
| Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization S Jeon, J Lee, S Hong, H Seo, Y Cho, P Liu, K Park, T Kim Materials Science in Semiconductor Processing 138, 106280, 2022 | 8 | 2022 |
| Simulation and experimental investigation of the radial groove effect on slurry flow in oxide chemical mechanical polishing Y Cho, P Liu, S Jeon, J Lee, S Bae, S Hong, YH Kim, T Kim Applied Sciences 12 (9), 4339, 2022 | 5 | 2022 |
| Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning J Lee, H Seo, SH Park, E Kim, J Lee, P Liu, S Jeon, S Hong, T Kim Materials Science in Semiconductor Processing 145, 106618, 2022 | 3 | 2022 |
| Silica Particle Removal Mechanism in Copper Buff Cleaning P Liu, J Lee, D Kwak, J Lee, H Seo, S Hong, T Kim 239th ECS Meeting with the 18th International Meeting on Chemical Sensors …, 2021 | | 2021 |
| Investigation of CMP Performance According to Pad Surface Condition and Abrasive Types S Jeon, J Lee, S Hong, K Kim, K Park, C Kim, T Kim Electrochemical Society Meeting Abstracts 239, 833-833, 2021 | | 2021 |
Taesung KimSungkyunkwan UniversityVerified email at skku.edu
