| Extraordinary combination of strength and ductility in an additively manufactured Fe-based medium entropy alloy through in situ formed η-nanoprecipitate and heterogeneous … F Haftlang, ES Kim, J Kwon, YU Heo, HS Kim Additive Manufacturing 63, 103421, 2023 | 15 | 2023 |
| Constitutive modeling of cellular-structured metals produced by additive manufacturing J Kwon, GM Karthik, Y Estrin, HS Kim Acta Materialia 241, 118421, 2022 | 13 | 2022 |
| Printed stretchable single-nanofiber interconnections for individually-addressable highly-integrated transparent stretchable field effect transistor array DW Kim, J Kwon, HS Kim, U Jeong Nano Letters 21 (13), 5819-5827, 2021 | 11 | 2021 |
| Determination of damage model parameters using nano-and bulk-scale digital image correlation and the finite element method GH Gu, J Kwon, J Moon, H Kwon, J Lee, Y Kim, ES Kim, MH Seo, ... Journal of Materials Research and Technology 17, 392-403, 2022 | 10 | 2022 |
| Constitutive modeling and finite element analysis of metastable medium entropy alloy J Kwon, J Lee, HS Kim Materials Science and Engineering: A 840, 142915, 2022 | 8 | 2022 |
| Role of synergistic hardening and damage evolution on the stretchability of Al1050/steel/Al1050 sheets RE Kim, GH Gu, H Kwon, SY Ahn, J Kwon, JA Lee, YT Choi, MH Seo, ... Journal of Materials Research and Technology 21, 3514-3525, 2022 | 7 | 2022 |
| Excellent combination of cryogenic strength and ductility of a metastable Fe65Ni15Co8Mn8Ti3Si medium entropy alloy through the exceptional deformation-induced martensitic … F Haftlang, J Kwon, J Moon, P Asghari-Rad, HS Kim Journal of Materials Science 57 (38), 18062-18074, 2022 | 6 | 2022 |
| Multiple-stage strain hardening due to the deformation-induced martensitic transformation in additively manufactured high-entropy alloy J Kwon, F Haftlang, YT Choi, ES Kim, HS Kim Materials Research Letters 12 (1), 50-57, 2024 | 1 | 2024 |
| Effect of cell characteristics on mechanical properties of AlSi10Mg alloy fabricated by laser powder bed fusion J Kwon, YT Choi, ES Kim, SY Ahn, SG Jeong, M Kang, H Joo, JM Park, ... Materials Science and Engineering: A, 146537, 2024 | | 2024 |
| Analysis of Die Compaction of Chip Geometry through Porous Continuum Model‐Based Approach JA Lee, J Kwon, G Kwon, SJ Hong, HS Kim Advanced Engineering Materials 26 (4), 2300823, 2024 | | 2024 |
| Finite Element Modeling of Crumpling of Metallic Thin Foil J Kwon, O Bouaziz, HS Kim, Y Estrin Advanced Engineering Materials 25 (13), 2300063, 2023 | | 2023 |
