David L Tomasko
David L Tomasko
Professor of Chemical Engineering, The Ohio State University
osu.edu의 이메일 확인됨
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Polymer nanocomposite foams
LJ Lee, C Zeng, X Cao, X Han, J Shen, G Xu
Composites science and technology 65 (15-16), 2344-2363, 2005
8422005
A Review of CO2 Applications in the Processing of Polymers
DL Tomasko, H Li, D Liu, X Han, MJ Wingert, LJ Lee, KW Koelling
Industrial & Engineering Chemistry Research 42 (25), 6431-6456, 2003
7752003
Electrospinning for tissue engineering scaffolds
J Lannutti, D Reneker, T Ma, D Tomasko, D Farson
Materials Science and Engineering: C 27 (3), 504-509, 2007
7382007
Morphology and mechanical properties of polypropylene/organoclay nanocomposites
P Svoboda, C Zeng, H Wang, LJ Lee, DL Tomasko
Journal of Applied polymer science 85 (7), 1562-1570, 2002
3242002
Extrusion of polystyrene nanocomposite foams with supercritical CO2
X Han, C Zeng, LJ Lee, KW Koelling, DL Tomasko
Polymer Engineering & Science 43 (6), 1261-1275, 2003
3002003
Polymer–clay nanocomposite foams prepared using carbon dioxide
C Zeng, X Han, LJ Lee, KW Koelling, DL Tomasko
Advanced Materials 15 (20), 1743-1747, 2003
2912003
Solubility of naproxen in supercritical carbon dioxide with and without cosolvents
SST Ting, DL Tomasko, NR Foster, SJ Macnaughton
Industrial & engineering chemistry research 32 (7), 1471-1481, 1993
2631993
Microencapsulation of naproxen using rapid expansion of supercritical solutions
JH Kim, TE Paxton, DL Tomasko
Biotechnology Progress 12 (5), 650-661, 1996
2451996
Fluorescence spectroscopy studies of dilute supercritical solutions
JF Brennecke, DL Tomasko, J Peshkin, CA Eckert
Industrial & engineering chemistry research 29 (8), 1682-1690, 1990
1901990
Continuous microcellular polystyrene foam extrusion with supercritical CO2
X Han, KW Koelling, DL Tomasko, LJ Lee
Polymer Engineering & Science 42 (11), 2094-2106, 2002
1682002
High‐resolution adsorption isotherms of supercritical carbon dioxide on activated carbon
R Humayun, DL Tomasko
AIChE Journal 46 (10), 2065-2075, 2000
1612000
Development of CO2 for polymer foam applications
DL Tomasko, A Burley, L Feng, SK Yeh, K Miyazono, S Nirmal-Kumar, ...
The Journal of Supercritical Fluids 47 (3), 493-499, 2009
1552009
Vapor− Liquid equilibrium for binary systems of carbon dioxide+ methanol, hydrogen+ methanol, and hydrogen+ carbon dioxide at high pressures
K Bezanehtak, GB Combes, F Dehghani, NR Foster, DL Tomasko
Journal of Chemical & Engineering Data 47 (2), 161-168, 2002
1312002
Influence of chemical modifiers on the solubility of o-and m-hydroxybenzoic acid in supercritical carbon dioxide
GS Gurdial, SJ Macnaughton, DL Tomasko, NR Foster
Industrial & engineering chemistry research 32 (7), 1488-1497, 1993
1211993
Supercritical carbon dioxide assisted blending of polystyrene and poly (methyl methyacrylate)
MD Elkovitch, DL Tomasko, LJ Lee
Polymer Engineering & Science 39 (10), 2075-2084, 1999
1201999
The effect of pressurized carbon dioxide as a temporary plasticizer and foaming agent on the hot stage extrusion process and extrudate properties of solid dispersions of …
G Verreck, A Decorte, K Heymans, J Adriaensen, D Cleeren, A Jacobs, ...
European journal of pharmaceutical sciences 26 (3-4), 349-358, 2005
1192005
Supercritical fluid applications in polymer nanocomposites
DL Tomasko, X Han, D Liu, W Gao
Current Opinion in Solid State and Materials Science 7 (4-5), 407-412, 2003
1192003
The effect of pressurized carbon dioxide as a plasticizer and foaming agent on the hot melt extrusion process and extrudate properties of pharmaceutical polymers
G Verreck, A Decorte, H Li, D Tomasko, A Arien, J Peeters, P Rombaut, ...
The Journal of supercritical fluids 38 (3), 383-391, 2006
1162006
Hot stage extrusion of p-amino salicylic acid with EC using CO2 as a temporary plasticizer
G Verreck, A Decorte, K Heymans, J Adriaensen, D Liu, D Tomasko, ...
International journal of pharmaceutics 327 (1-2), 45-50, 2006
1142006
Effect of carbon dioxide on the interfacial tension of polymer melts
H Li, LJ Lee, DL Tomasko
Industrial & engineering chemistry research 43 (2), 509-514, 2004
1082004
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