| Chemistry of copper (I). beta.-diketonate complexes. 2. Synthesis, characterization, and physical properties of (. beta.-diketonato) copper (I) trimethylphosphine and bis … HK Shin, KM Chi, J Farkas, MJ Hampden-Smith, TT Kodas, EN Duesler Inorganic Chemistry 31 (3), 424-431, 1992 | 125 | 1992 |
| Chemical vapor deposition of copper from copper (I) trimethylphosphine compounds MJ Hampden-Smith, TT Kodas, M Paffett, JD Farr, HK Shin Chemistry of Materials 2 (6), 636-639, 1990 | 111 | 1990 |
| Hot-wall chemical vapor deposition of copper from copper (I) compounds. 2. Selective, low-temperature deposition of copper from copper (I). beta.-diketonate compounds,(. beta … HK Shin, KM Chi, MJ Hampden-Smith, TT Kodas, JD Farr, M Paffett Chemistry of materials 4 (4), 788-795, 1992 | 107 | 1992 |
| The chemistry of β-diketonate copper (I) compounds—III. The synthesis of (β-diketonate) Cu (1, 5-COD) compounds, the solid state structure and disproportionation of … KM Chi, HK Shin, MJ Hampden-Smith, EN Duesler, TT Kodas Polyhedron 10 (19), 2293-2299, 1991 | 100 | 1991 |
| Selective low‐temperature chemical vapor deposition of copper from (hexafluoroacetylacetonato)copper(I)trimethylphosphine, (hfa)CuP(Me)3 TT Kodas, HK Shin, KM Chi, MJ Hampden‐Smith, JD Farr, M Paffett Advanced Materials 3 (5), 246-248, 1991 | 79 | 1991 |
| Synthesis and characterization of (. beta.-diketonato) copper (I) alkyne complexes: structural characterization of (hexafluoroacetylacetonato)(diphenylacetylene) copper (I) KM Chi, HK Shin, MJ Hampden-Smith, TT Kodas, EN Duesler Inorganic Chemistry 30 (23), 4293-4294, 1991 | 76 | 1991 |
| Preparation of volatile, monomeric copper (I) β-diketonate complexes HK Shin, MJ Hampden-Smith, EN Duesler, TT Kodas Polyhedron 10 (6), 645-647, 1991 | 60 | 1991 |
| MOCVD of Titanium Nitride from a New Precursor, Ti[N(CH3)C2H5]4 HK Shin, HJ Shin, JG Lee, SW Kang, BT Ahn Chemistry of materials 9 (1), 76-80, 1997 | 57 | 1997 |
| The chemistry of copper(I) β-diketonate compounds. Part V. Syntheses and characterization of (β-diketonate)CuLn species where L = PBu3, PPh3, and PCy3; n = 1 and 2; crystal and molecular structures of (acac)Cu(PCy … HK Shin, MJ Hampden-Smith, EN Duesler, TT Kodas Canadian Journal of Chemistry 70 (12), 2954-2966, 1992 | 51 | 1992 |
| MJ Hampden-Smith, TT Kodas, MF Paffett and JD Farr HK Shin, KM Chi Angew. Chem. Advanced Materials 3, 246, 1991 | 44 | 1991 |
| Chemical vapor deposition of copper with a new metalorganic source ES Choi, SK Park, HK Shin, HH Lee Applied physics letters 68 (7), 1017-1019, 1996 | 31 | 1996 |
| Synthesis of volatile, fluorinated β-ketoiminato copper (I) complexes HK Shin, MJ Hampden-Smith, TT Kodas, AL Rheingold Journal of the Chemical Society, Chemical Communications, 217-219, 1992 | 30 | 1992 |
| Precursor compounds for deposition of ceramic and metal films and preparation methods thereof H Shin US Patent App. 11/078,610, 2005 | 26 | 2005 |
| Semiconductor International A Hand Jan, 2003 | 17 | 2003 |
| Precursor compounds for metal oxide film deposition and methods of film deposition using the same H Shin US Patent App. 10/002,275, 2003 | 16 | 2003 |
| Synthesis of New Copper (I) β-Diketonate Compounds for CVD of Copper HK Shin, KM Chi, MJ Hampden-Smith, TT Kodas, JD Farr, MF Paffeif MRS Online Proceedings Library (OPL) 204, 421, 1990 | 16 | 1990 |
| Preparation of TaN thin film by H2 plasma assisted atomic layer deposition using tert-butylimino-tris-ethylmethylamino tantalum DK Kim, BH Kim, HG Woo, DH Kim, HK Shin Journal of nanoscience and nanotechnology 6 (11), 3392-3395, 2006 | 14 | 2006 |
| Aluminum complex derivatives for chemical vacuum evaporation and the method of producing the same H Shin, HJ Shin US Patent 6,399,772, 2002 | 14 | 2002 |
| Method for manufacturing a gate electrode of a MOS transistor H Shin, KC Park, J Moon, T Shim US Patent 5,501,995, 1996 | 11 | 1996 |
| Influence of the deposition temperature on the properties of copper thin films prepared by alternating injection of Cu (ethylketoiminate) 2 and H2 on a ruthenium substrate KM Park, JK Kim, B Han, WJ Lee, J Kim, HK Shin Microelectronic engineering 89, 27-30, 2012 | 10 | 2012 |
