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- Baowen LiSouthern University of Science and Technology, University of Colorado, Boulder, National UniversityVerified email at sustech.edu.cn
- Cheng-Wei QIUProfessor, National University of SingaporeVerified email at nus.edu.sg
- JTL ThongProfessor, Singapore Institute of TechnologyVerified email at SingaporeTech.edu.sg
- Tiancheng HanSchool of Physical Science and Technology, Southwest University, Chongqing 400715, ChinaVerified email at swu.edu.cn
- Dongliang GaoSoochow UniversityVerified email at suda.edu.cn
- Tianzhi YangProfessor, Northeastern University, TU-DarmstadtVerified email at me.neu.edu.cn
- Jian-Bin XU (许建斌, J.B. XU)Chinese University of Hong Kong (CUHK); Shenzhen Institute of Advanced Technology (SIAT), CASVerified email at ee.cuhk.edu.hk
- Ying LiZhejiang UniversityVerified email at zju.edu.cn
- Ting LiangThe Chinese University of Hong KongVerified email at link.cuhk.edu.hk
- Xiangfan XUCenter for Phononics and Thermal Energy Science, Tongji UniversityVerified email at tongji.edu.cn
- Meng HanShenzhen Institute of Advanced TechnologyVerified email at siat.ac.cn
- Jing WuProfessor, School of Electronic Science & Engineering, Southeast University, ChinaVerified email at seu.edu.cn
- Yimin Yao (么依民)PhD, Associate Researcher, SIEM, SIAT, CASVerified email at siat.ac.cn
- Yu ChenResearch Scientist, Commonwealth Scientific and Industrial Research Organisation (CSIRO)Verified email at e.ntu.edu.sg
- Yumeng YangShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Xiang ZHANGUniversity of Hong KongVerified email at hku.hk
- Jun LiuSichuan UniversityVerified email at scu.edu.cn
- Xiangying ShenSouthern University of Science and TechnologyVerified email at sustech.edu.cn