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Jae Jeong Kim
Jae Jeong Kim
Verified email at snu.ac.kr
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Electrodeposited Ni dendrites with high activity and durability for hydrogen evolution reaction in alkaline water electrolysis
SH Ahn, SJ Hwang, SJ Yoo, I Choi, HJ Kim, JH Jang, SW Nam, TH Lim, ...
Journal of Materials Chemistry 22 (30), 15153-15159, 2012
2062012
Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition
J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim
Chemical Engineering Journal 299, 37-44, 2016
1802016
Fabrication and characterization of a PDMS–glass hybrid continuous-flow PCR chip
JA Kim, JY Lee, S Seong, SH Cha, SH Lee, JJ Kim, TH Park
Biochemical Engineering Journal 29 (1-2), 91-97, 2006
1682006
Enhanced catalytic activity of electrodeposited Ni-Cu-P toward oxygen evolution reaction
BK Kim, SK Kim, SK Cho, JJ Kim
Applied Catalysis B: Environmental 237, 409-415, 2018
1322018
Fading mechanisms of carbon-coated and disproportionated Si/SiOx negative electrode (Si/SiOx/C) in Li-ion secondary batteries: Dynamics and component analysis by TEM
I Choi, MJ Lee, SM Oh, JJ Kim
Electrochimica Acta 85, 369-376, 2012
1322012
Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization
JJ Kim, SK Kim, YS Kim
Journal of electroanalytical chemistry 542, 61-66, 2003
1212003
Superfilling evolution in Cu electrodeposition: dependence on the aging time of the accelerator
SK Kim, JJ Kim
Electrochemical and solid-state letters 7 (9), C98, 2004
1042004
The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation
MS Kang, SK Kim, K Kim, JJ Kim
Thin Solid Films 516 (12), 3761-3766, 2008
912008
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)
CH Lee, SC Lee, JJ Kim
Electrochimica acta 50 (16-17), 3563-3568, 2005
862005
Superconformal Cu electrodeposition using DPS: a substitutive accelerator for bis (3-sulfopropyl) disulfide
SK Cho, SK Kim, JJ Kim
Journal of the Electrochemical Society 152 (5), C330, 2005
702005
Hydrogen production by auto-thermal reforming of ethanol over Ni/γ-Al2O3 catalysts: Effect of second metal addition
MH Youn, JG Seo, P Kim, JJ Kim, HI Lee, IK Song
Journal of power sources 162 (2), 1270-1274, 2006
692006
Investigation of copper deposition in the presence of benzotriazole
JJ Kim, SK Kim, JU Bae
Thin Solid Films 415 (1-2), 101-107, 2002
632002
Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor
MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim
Journal of the Electrochemical Society 160 (12), D3221, 2013
612013
Degradation of bis (3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling
S Choe, MJ Kim, HC Kim, SK Cho, SH Ahn, SK Kim, JJ Kim
Journal of The Electrochemical Society 160 (12), D3179, 2013
612013
Capacity variation of carbon-coated silicon monoxide negative electrode for lithium-ion batteries
KW Kim, H Park, JG Lee, J Kim, YU Kim, JH Ryu, JJ Kim, SM Oh
Electrochimica Acta 103, 226-230, 2013
612013
Optimized surface pretreatments for copper electroplating
JJ Kim, SK Kim
Applied surface science 183 (3-4), 311-318, 2001
592001
Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel–alumina xerogel catalysts: effect of nickel content
JG Seo, MH Youn, HI Lee, JJ Kim, E Yang, JS Chung, P Kim, IK Song
Chemical Engineering Journal 141 (1-3), 298-304, 2008
582008
Method of catalyst coating in micro-reactors for methanol steam reforming
SM Hwang, OJ Kwon, JJ Kim
Applied Catalysis A: General 316 (1), 83-89, 2007
572007
A comparative study on thermal stability of two solid electrolyte interphase (SEI) films on graphite negative electrode
H Park, T Yoon, J Mun, JH Ryu, JJ Kim, SM Oh
Journal of The Electrochemical Society 160 (9), A1539, 2013
552013
One-step co-electrodeposition of Pt–Ru electrocatalysts on carbon paper for direct methanol fuel cell
SH Ahn, I Choi, OJ Kwon, JJ Kim
Chemical engineering journal 181, 276-280, 2012
532012
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