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Yu Dian Lim
Yu Dian Lim
ntu.edu.sg의 이메일 확인됨
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Novel three-dimensional carbon nanotube networks as high performance thermal interface materials
Q Kong, L Bodelot, B Lebental, YD Lim, LL Shiau, B Gusarov, CW Tan, ...
Carbon 132, 359-369, 2018
352018
Enhanced field emission properties of carbon nanotube films using densification technique
YD Lim, Q Kong, S Wang, CW Tan, BK Tay, S Aditya
Applied Surface Science 477, 211-219, 2019
282019
Enhanced carbon nanotubes growth using nickel/ferrocene-hybridized catalyst
YD Lim, AV Avramchuck, D Grapov, CW Tan, BK Tay, S Aditya, ...
ACS omega 2 (9), 6063-6071, 2017
272017
TSV-integrated surface electrode ion trap for scalable quantum information processing
P Zhao, JP Likforman, HY Li, J Tao, T Henner, YD Lim, WW Seit, CS Tan, ...
Applied Physics Letters 118 (12), 2021
222021
Field emission cathode based on three-dimensional framework carbon and its operation under the driving of a triboelectric nanogenerator
J Chen, B Yang, YD Lim, L Su, J Yang, R Guo, BK Tay, X Yan
Nano Energy 49, 308-315, 2018
212018
Enhanced field emission properties of carbon nanotube bundles confined in SiO2 pits
YD Lim, D Grapov, L Hu, Q Kong, BK Tay, V Labunov, J Miao, P Coquet, ...
Nanotechnology 29 (7), 075205, 2018
202018
Ti3C2 (MXene) based field electron emitters
J Chen, B Yang, YD Lim, W Duan, Y Zhao, BK Tay, X Yan
Nanotechnology 31 (28), 285701, 2020
162020
Thermal conductivity characterization of three dimensional carbon nanotube network using freestanding sensor-based 3ω technique
Q Kong, L Qiu, YD Lim, CW Tan, K Liang, C Lu, BK Tay
Surface and Coatings Technology 345, 105-112, 2018
152018
In-depth parametric study of Ar or N2 plasma activated Cu surfaces for Cu-Cu direct bonding
L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, CS Tan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 420-425, 2021
132021
Fabrication and characterization of surface electrode ion trap for quantum computing
J Tao, NP Chew, L Guidoni, YD Lim, P Zhao, CS Tan
2018 ieee 20th electronics packaging technology conference (eptc), 363-366, 2018
122018
Advanced 3D integration technologies in various quantum computing devices
P Zhao, YD Lim, HY Li, G Luca, CS Tan
IEEE Open Journal of Nanotechnology 2, 101-110, 2021
112021
Field emission properties of SiO2-wrapped CNT field emitter
YD Lim, L Hu, X Xia, Z Ali, S Wang, BK Tay, S Aditya, J Miao
Nanotechnology 29 (1), 015202, 2017
112017
Design and fabrication of grating couplers for the optical addressing of trapped ions
YD Lim, HY Li, P Zhao, J Tao, L Guidoni, CS Tan
IEEE Photonics Journal 13 (4), 1-6, 2021
102021
Temperature-dependent selective growth of carbon nanotubes in Si/SiO2 structures for field emitter array applications
YD Lim, L Hu, AV Avramchuck, D Grapov, BK Tay, S Aditya, J Miao, ...
Materials research bulletin 95, 129-137, 2017
102017
Time-dependent evolution study of Ar/N2 plasma-activated Cu surface for enabling two-step Cu-Cu direct bonding in a non-vacuum environment
L Hu, SCK Goh, J Tao, YD Lim, P Zhao, MJZ Lim, T Salim, ...
ECS Journal of Solid State Science and Technology 10 (12), 124001, 2021
82021
Glass substrate interposer for TSV-integrated surface electrode ion trap
P Zhao, HY Li, YD Lim, J Tao, WW Seit, L Guidoni, CS Tan
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 262-265, 2020
82020
Chemical reaction dependency, magnetic field and surfactant effects on the propulsion of disk‐like micromotor and its application for E. coli transportation
L Hu, N Wang, YD Lim, J Miao
Nano Select 1 (4), 432-442, 2020
82020
Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct Bonding
L Hu, YD Lim, P Zhao, MJZ Lim, CS Tan
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 324-329, 2022
72022
Multi-die to wafer bonding through plasma-activated Cu-Cu direct bonding in ambient conditions
L Hu, SCK Goh, YD Lim, P Zhao, MJZ Lim, CS Tan
2021 IEEE International 3D Systems Integration Conference (3DIC), 1-5, 2021
72021
RF performance benchmarking of TSV integrated surface electrode ion trap for quantum computing
P Zhao, HY Li, J Tao, JP Likforman, YD Lim, WW Seit, L Guidoni, CS Tan
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
72021
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학술자료 1–20