| Scanning resistive probe microscopy: Imaging ferroelectric domains H Park, J Jung, DK Min, S Kim, S Hong, H Shin Applied physics letters 84 (10), 1734-1736, 2004 | 98 | 2004 |
| Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics M Park, S Baek, S Kim, SE Kim Applied Surface Science 324, 168-173, 2015 | 52 | 2015 |
| Interface, Volume, and Thermal Attenuation of Hot-Electron Spins in Ni_ {80} Fe_ {20} and Co R Vlutters, OMJ Van't Erve, SD Kim, R Jansen, JC Lodder Physical review letters 88 (2), 27202, 2001 | 46 | 2001 |
| Wafer warpage analysis of stacked wafers for 3D integration Y Kim, SK Kang, SD Kim, SE Kim Microelectronic engineering 89, 46-49, 2012 | 43 | 2012 |
| Transfer ratio of the spin-valve transistor OMJ van’t Erve, R Vlutters, PS Kumar, SD Kim, FM Postma, R Jansen, ... Applied physics letters 80 (20), 3787-3789, 2002 | 43 | 2002 |
| The spin-valve transistor: fabrication, characterization, and physics R Jansen, OMJ Van’t Erve, SD Kim, R Vlutters, PS Anil Kumar, JC Lodder Journal of Applied Physics 89 (11), 7431-7436, 2001 | 43 | 2001 |
| Effect of radio frequency power on the properties of p-type SnO deposited via sputtering J Um, BM Roh, S Kim, SE Kim Materials science in semiconductor processing 16 (6), 1679-1683, 2013 | 40 | 2013 |
| Wafer level Cu–Cu direct bonding for 3D integration SE Kim, S Kim Microelectronic Engineering 137, 158-163, 2015 | 39 | 2015 |
| Magnetoresistance behavior of a magnetic tunnel junction with perpendicularly magnetized multilayers D Lim, S Kim, SR Lee Journal of applied physics 97 (10), 10C902, 2005 | 37 | 2005 |
| Modeling of spin-dependent hot-electron transport in the spin-valve transistor R Vlutters, OMJ van’t Erve, R Jansen, SD Kim, JC Lodder, A Vedyayev, ... Physical Review B 65 (2), 024416, 2001 | 32 | 2001 |
| Assessment of dry etching damage in permalloy thin films SD Kim, JJ Lee, SH Lim, HJ Kim Journal of applied physics 85 (8), 5992-5994, 1999 | 29 | 1999 |
| Fabrication and challenges of Cu-to-Cu wafer bonding 강성근， 이지은， 김은솔， 임나은， 김수형， 김성동 마이크로전자 및 패키징학회지 19 (2), 29-33, 2012 | 28 | 2012 |
| Wafer Level Bonding Technology for 3D Stacked IC YH Cho, SE Kim, S Kim Journal of the Microelectronics and Packaging Society 20 (1), 7-13, 2013 | 26 | 2013 |
| Method of writing data on a storage device using a probe technique S Hong, SD Kim, JH Jung, D Min, HS Park, K Baeck, C Park, YS Kim US Patent 7,406,020, 2008 | 26 | 2008 |
| 300% magnetocurrent in a room temperature operating spin-valve transistor PSA Kumar, R Jansen, OMJ van’t Erve, R Vlutters, SD Kim, JC Lodder Physica C: Superconductivity 350 (3-4), 166-170, 2001 | 25 | 2001 |
| TSV liquid cooling system for 3D integrated circuits M Park, S Kim, SE Kim Journal of the Microelectronics and Packaging Society 20 (3), 1-6, 2013 | 21 | 2013 |
| Analysis of electromigration for Cu pillar bump in flip chip package JH Yoo, IS Kang, GJ Jung, S Kim, HS Ahn, WH Choi, KS Jun, DW Jang, ... 2010 12th Electronics Packaging Technology Conference, 129-133, 2010 | 21 | 2010 |
| Fabrication of atomic force microscope probe with low spring constant using SU-8 photoresist J Lee, H Shin, S Kim, S Hong, J Chung, H Park, J Moon Japanese journal of applied physics 42 (10A), L1171, 2003 | 21 | 2003 |
| Transparent SnOx thin films fabricated by radio frequency reactive sputtering with a SnO/Sn composite target C Kim, S Kim, SE Kim Thin Solid Films 634, 175-180, 2017 | 19 | 2017 |
| The effects of heat treatment on room temperature ferromagnetism in a digitally Co doped ZnO thin film S Kang, Y Kim, SE Kim, S Kim Electronic Materials Letters 9, 7-11, 2013 | 18 | 2013 |
