EUV lithography imaging using novel pellicle membranes I Pollentier, J Vanpaemel, JU Lee, C Adelmann, H Zahedmanesh, ... Extreme Ultraviolet (EUV) Lithography VII 9776, 587-600, 2016 | 25 | 2016 |
Novel membrane solutions for the EUV pellicle: better or not? I Pollentier, JU Lee, M Timmermans, C Adelmann, H Zahedmanesh, ... Extreme Ultraviolet (EUV) Lithography VIII 10143, 125-134, 2017 | 23 | 2017 |
Properties and performance of EUVL pellicle membranes EE Gallagher, J Vanpaemel, I Pollentier, H Zahedmanesh, C Adelmann, ... Photomask Technology 2015 9635, 206-213, 2015 | 23 | 2015 |
CNT EUV pellicle: moving towards a full-size solution MY Timmermans, I Pollentier, JU Lee, J Meersschaut, O Richard, ... Photomask Technology 2017 10451, 158-172, 2017 | 18 | 2017 |
Introducing the EUV CNT pellicle JU Lee, J Vanpaemel, I Pollentier, C Adelmann, H Zahedmanesh, ... Photomask Technology 2016 9985, 26-33, 2016 | 18 | 2016 |
Improved imaging properties of thin attenuated phase shift masks for extreme ultraviolet lithography S Lee, I Lee, J Gul Doh, J Uk Lee, S Hong, J Ahn Journal of Vacuum Science & Technology B 31 (2), 2013 | 18 | 2013 |
Three-layer BEOL process integration with supervia and self-aligned-block options for the 3 nm node V Vega-Gonzalez, CJ Wilson, B Briggs, S Decoster, J Versluijs, ... 2019 IEEE International Electron Devices Meeting (IEDM), 19.3. 1-19.3. 4, 2019 | 14 | 2019 |
IMEC N7, N5 and beyond: DTCO, STCO and EUV insertion strategy to maintain affordable scaling trend R Kim, Y Sherazi, P Debacker, P Raghavan, J Ryckaert, A Malik, ... Design-Process-Technology Co-optimization for Manufacturability XII 10588 …, 2018 | 12 | 2018 |
Very thin extreme ultraviolet mask absorber material for extremely fine pitch patterning JU Lee, S Hong, J Ahn Applied Physics Express 6 (7), 076502, 2013 | 12 | 2013 |
CNTs in the context of EUV pellicle history E Gallagher, MY Timmermans, I Pollentier, JU Lee, M Mariano, ... Extreme Ultraviolet (EUV) Lithography IX 10583, 317-324, 2018 | 10 | 2018 |
Carbon contamination of EUV mask and its effect on CD performance S Lee, JG Doh, JU Lee, I Lee, CY Jeong, DG Lee, S Rah, J Ahn Current applied physics 11 (4), S107-S110, 2011 | 9 | 2011 |
Actinic critical dimension measurement of contaminated extreme ultraviolet mask using coherent scattering microscopy J Uk Lee, S Hong, J Ahn, J Doh, SJ Jeong Journal of Vacuum Science & Technology B 32 (3), 2014 | 8 | 2014 |
SALELE process from theory to fabrication Y Drissi, W Gillijns, JU Lee, RR han Kim, A Hamed-Fatehy, R Kotb, ... Design-Process-Technology Co-optimization for Manufacturability XIII 10962 …, 2019 | 7 | 2019 |
Evaluation of lithographic performance of extreme ultra violet mask using coherent scattering microscope J Doh, J Uk Lee, J Ahn, S Kim Journal of Vacuum Science & Technology B 30 (6), 2012 | 7 | 2012 |
Determination of the CD performance and carbon contamination of an EUV mask by using a coherent scattering microscopy/in-situ contamination system J Doh, CY Jeong, S Lee, JU Lee, H Cha, J Ahn, DG Lee, SS Kim, HK Cho, ... Journal of the Korean Physical Society 57 (6), 1486-1489, 2010 | 7 | 2010 |
Coherent scattering microscopy as an effective inspection tool for analyzing performance of phase shift mask DG Woo, JU Lee, SC Hong, JS Kim, J Ahn Optics Express 24 (11), 12055-12062, 2016 | 6 | 2016 |
Stochastic patterning simulation using attenuated phase-shift mask for extreme ultraviolet lithography S Hong, S Jeong, JU Lee, SM Lee, J Ahn Applied Physics Express 6 (9), 096501, 2013 | 6 | 2013 |
EUV single patterning for logic metal layers: achievement and challenge (conference presentation) RH Kim, W Gillijns, Y Drissi, JU Lee, D Trivkovic, VMB Carballo, ... International Conference on Extreme Ultraviolet Lithography 2017 10450, 1045004, 2017 | 5 | 2017 |
Semi-damascene integration of a 2-layer MOL VHV scaling booster to enable 4-track standard cells V Vega-Gonzalez, D Radisic, S Choudhury, D Tierno, A Thiam, D Batuk, ... 2022 International Electron Devices Meeting (IEDM), 23.2. 1-23.2. 4, 2022 | 4 | 2022 |
Exploring the synergy between EUV lithography and directed self-assembly HS Suh, L Verstraete, J Van Bel, P Bézard, G Mannaert, JU Lee, S Wang, ... Novel Patterning Technologies 2022, PC1205402, 2022 | 4 | 2022 |