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Hongjun YangMetaVerified email at meta.com
Jung-Hun SeoUniversity at Buffalo, SUNYVerified email at buffalo.edu
Deyin ZhaoUniversity of Texas at Arlington; Semerane Inc.Verified email at uta.edu
Munho KimAssistant Professor of EEE at Nanyang Technological UniversityVerified email at ntu.edu.sg
Shanhui FanProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
Yi-Chen ShuaiNational Institute of Standards and TechnologyVerified email at nist.gov
Shih-Chia (LEO) LiuMarvell Technology, Inc.Verified email at mavs.uta.edu
Mattias HammarKTH - Royal Institute of TechnologyVerified email at KTH.se
Sang June ChoElectrical Engineering at UW-MadisonVerified email at wisc.edu
Dong LiuUniversity of Wisconsin MadisonVerified email at wisc.edu
Richard A. SorefResearch Professor of Engineering, The University of Massachusetts at BostonVerified email at rcn.com
Shaoqin Sarah GongProfessor, University of Wisconsin-Madison, Dept. of Biomedical Engineering and WIDVerified email at engr.wisc.edu
Arvinder ChadhaSenior Engineering Manager, Applied MaterialsVerified email at mavs.uta.edu
Xiuling LiUniversity of Texas at AustinVerified email at utexas.edu
omar qasaimehProfVerified email at just.edu.jo
Akhil Raj Kumar KalapalaIntel CorporationVerified email at mavs.uta.edu
Xiaochen GeNokiaVerified email at nokia.com
Zhonghe LiuPhD, ZJE SemicomVerified email at mavs.uta.edu
Meng TaoArizona State UniversityVerified email at asu.edu
Yuze SunAssociate Professor, Electrical Engineering, University of Texas at ArlingtonVerified email at uta.edu