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Michael Belyansky
Michael Belyansky
Senior Scientist, IBM Corporation
Verified email at us.ibm.com
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Cited by
Year
Interconnect limits on gigascale integration (GSI) in the 21st century
JA Davis, R Venkatesan, A Kaloyeros, M Beylansky, SJ Souri, K Banerjee, ...
Proceedings of the IEEE 89 (3), 305-324, 2001
9272001
Dual stress liner for high performance sub-45nm gate length SOI CMOS manufacturing
HS Yang, R Malik, S Narasimha, Y Li, R Divakaruni, P Agnello, S Allen, ...
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004
2342004
Structure and method to improve channel mobility by gate electrode stress modification
MP Belyansky, D Chidambarrao, OH Dokumaci, BB Doris, O Gluschenkov
US Patent 6,977,194, 2005
2182005
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
P Agnello, T Ivers, C Warm, R Wise, R Wachnik, D Schepis, S Sankaran, ...
2006 International Electron Devices Meeting, 1-4, 2006
1332006
Stressed semiconductor device structures having granular semiconductor material
BB Doris, MP Belyansky, DC Boyd, D Chidambarrao, O Gluschenkov
US Patent 7,122,849, 2006
1042006
Method of fabricating mobility enhanced CMOS devices
MP Belyansky, BB Doris, O Gluschenkov
US Patent 7,205,206, 2007
1002007
Structure and method to improve channel mobility by gate electrode stress modification
MP Belyansky, D Chidambarrao, OH Dokumaci, BB Doris, O Gluschenkov
US Patent 7,750,410, 2010
922010
Structure and method to improve channel mobility by gate electrode stress modification
M Belyansky, D Chidambarrao, O Dokumaci, B Doris, O Gluschenkov
US Patent App. 11/201,163, 2005
902005
High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
E Leobandung, H Nayakama, D Mocuta, K Miyamoto, M Angyal, HV Meer, ...
Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005., 126-127, 2005
852005
A Novel Dry Selective Etch of SiGe for the Enablement of High Performance Logic Stacked Gate-all-Around NanoSheet Devices
M Nicolas Loubet, Subhadeep Kal, Cheryl Alix, Shanti Pancharatnam, Huimei ...
International Electron Devices Meeting (IEDM), 2019
68*2019
Method of producing highly strained PECVD silicon nitride thin films at low temperature
MP Belyansky, O Gluschenkov, Y Li, A Mallikarjunan
US Patent 7,585,704, 2009
602009
High performance 32nm SOI CMOS with high-k/metal gate and 0.149µm2 SRAM and ultra low-k back end with eleven levels of copper
B Greene, Q Liang, K Amarnath, Y Wang, J Schaeffer, M Cai, Y Liang, ...
2009 Symposium on VLSI Technology, 140-141, 2009
602009
Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress
TA Brunner, VC Menon, CW Wong, O Gluschenkov, MP Belyansky, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 12 (4), 043002-043002, 2013
552013
Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress
M Belyansky, M Chace, O Gluschenkov, J Kempisty, N Klymko, A Madan, ...
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 26 (3 …, 2008
542008
High density plasma oxidation
M Belyansky, O Glushenkov, A Knorr
US Patent 7,273,638, 2007
532007
Trench isolation employing a doped oxide trench fill
M Belyansky, A Knorr, O Gluschenkov, C Parks
US Patent 6,890,833, 2005
502005
Oxidation method for altering a film structure and CMOS transistor structure formed therewith
MP Belyansky, DC Boyd, BB Doris, O Gluschenkov
US Patent 6,982,196, 2006
442006
Stress proximity technique for performance improvement with dual stress liner at 45nm technology and beyond
C Davis, JH Ku, T Schiml, J Sudijono, I Yang, A Steegen, D Coolbough, ...
2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers., 60-61, 2006
422006
Boron Chemical Shifts in B6O
M Belyansky, M Trenary, C Ellison
Surface science spectra 3 (2), 147-150, 1994
341994
High performance bulk planar 20nm CMOS technology for low power mobile applications
H Shang, S Jain, E Josse, E Alptekin, MH Nam, SW Kim, KH Cho, I Kim, ...
2012 Symposium on VLSI Technology (VLSIT), 129-130, 2012
302012
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