Electronic device and semiconductor package with thermally conductive via E Lee, SJ Han US Patent 9,674,940, 2017 | 11 | 2017 |
Heat dissipation analysis of m. 2 nvme solid-state drive in vacuum EC Lee, J Rho, BJ Lee, H Kang 2019 International Vacuum Electronics Conference (IVEC), 1-2, 2019 | 5 | 2019 |
Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum EC Lee, J Rho, H Kang, BJ Lee IEEE Electron Device Letters 39 (12), 1908-1911, 2018 | 5 | 2018 |
Floor-types identification method for wheel robot using impedance variation EC Lee, H Do Choi, SH Kim, YK Kwak 2008 International Conference on Control, Automation and Systems, 2340-2343, 2008 | 1 | 2008 |
Semiconductor Pacakge and Semiconductor Apparatus EC Lee US Patent 11,205,601, 2020 | | 2020 |
Semiconductor packages and data storage devices including the same EC Lee US Patent 9,599,516, 2017 | | 2017 |