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Eung Chang Lee, Ph.D
Title
Cited by
Cited by
Year
Electronic device and semiconductor package with thermally conductive via
E Lee, SJ Han
US Patent 9,674,940, 2017
112017
Heat dissipation analysis of m. 2 nvme solid-state drive in vacuum
EC Lee, J Rho, BJ Lee, H Kang
2019 International Vacuum Electronics Conference (IVEC), 1-2, 2019
52019
Thermal analysis of ball grid array non-volatile memory express solid-state drive in vacuum
EC Lee, J Rho, H Kang, BJ Lee
IEEE Electron Device Letters 39 (12), 1908-1911, 2018
52018
Floor-types identification method for wheel robot using impedance variation
EC Lee, H Do Choi, SH Kim, YK Kwak
2008 International Conference on Control, Automation and Systems, 2340-2343, 2008
12008
Semiconductor Pacakge and Semiconductor Apparatus
EC Lee
US Patent 11,205,601, 2020
2020
Semiconductor packages and data storage devices including the same
EC Lee
US Patent 9,599,516, 2017
2017
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Articles 1–6