| Architecture, chip, and package codesign flow for interposer-based 2.5-D chiplet integration enabling heterogeneous IP reuse J Kim, G Murali, H Park, E Qin, H Kwon, VCK Chekuri, NM Rahman, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (11 …, 2020 | 79 | 2020 |
| Architecture, chip, and package co-design flow for 2.5 D IC design enabling heterogeneous IP reuse J Kim, G Murali, H Park, E Qin, H Kwon, VCK Chekuri, N Dasari, A Singh, ... 2019 56th ACM/IEEE Design Automation Conference (DAC), 1-6, 2019 | 60 | 2019 |
| Pseudo-3D approaches for commercial-grade RTL-to-GDS tool flow targeting monolithic 3D ICs H Park, BW Ku, K Chang, DE Shim, SK Lim Proceedings of the 2020 International Symposium on Physical Design, 47-54, 2020 | 21 | 2020 |
| Physical Design for 3D Integrated Circuits - Design Methodology for TSV-Based 3D Clock Networks (Chapter 7) H Park, T Kim CRC Press, 2016 | 21* | 2016 |
| Design flow for active interposer-based 2.5-D ICs and study of RISC-V architecture with secure NoC H Park, J Kim, VCK Chekuri, MA Dolatsara, M Nabeel, A Bojesomo, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 17 | 2020 |
| Built-in self-test for inter-layer vias in monolithic 3D ICs A Chaudhuri, S Banerjee, H Park, BW Ku, K Chakrabarty, SK Lim 2019 IEEE European Test Symposium (ETS), 1-6, 2019 | 17 | 2019 |
| Synthesis of TSV fault-tolerant 3-D clock trees H Park, T Kim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014 | 16 | 2014 |
| RTL-to-GDS tool flow and design-for-test solutions for monolithic 3D ICs H Park, K Chang, BW Ku, J Kim, E Lee, D Kim, A Chaudhuri, S Banerjee, ... Proceedings of the 56th Annual Design Automation Conference 2019, 1-4, 2019 | 11 | 2019 |
| Advances in design and test of monolithic 3-D ICs A Chaudhuri, S Banerjee, H Park, J Kim, G Murali, E Lee, D Kim, SK Lim, ... IEEE Design & Test 37 (4), 92-100, 2020 | 9 | 2020 |
| Built-in self-test and fault localization for inter-layer vias in monolithic 3D ICs A Chaudhuri, S Banerjee, J Kim, H Park, BW Ku, S Kannan, ... ACM Journal on Emerging Technologies in Computing Systems (JETC) 18 (1), 1-37, 2021 | 7 | 2021 |
| Pseudo-3d physical design flow for monolithic 3d ics: Comparisons and enhancements H Park, BW Ku, K Chang, DE Shim, SK Lim ACM Transactions on Design Automation of Electronic Systems (TODAES) 26 (5 …, 2021 | 6 | 2021 |
| Structure optimizations of neuromorphic computing architectures for deep neural network H Park, T Kim 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 183-188, 2018 | 6 | 2018 |
| DTOC: integrating Deep-learning driven Timing Optimization into the state-of-the-art Commercial EDA tool K Chang, J Ahn, H Park, KM Choi, T Kim 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023 | 5 | 2023 |
| Synthesizing asynchronous circuits toward practical use H Park, T Kim 2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 47-52, 2016 | 5 | 2016 |
| Comprehensive technique for designing and synthesizing TSV fault-tolerant 3D clock trees H Park, T Kim 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 691-696, 2013 | 4 | 2013 |
| A systematic removal of minimum implant area violations under timing constraint E Jeong, H Park, T Kim 2022 Design, Automation & Test in Europe Conference & Exhibition (DATE), 933-938, 2022 | 3 | 2022 |
| Hybrid asynchronous circuit generation amenable to conventional EDA flow H Park, T Kim Integration 64, 29-39, 2019 | 3 | 2019 |
| Integrated circuit having main route and detour route for signal transmission and integrated circuit package including the same LIM Kyounghwan, HS Park, KS Kim, LEE Bonghyun, RIM Chul, ... US Patent 9,524,922, 2016 | 3 | 2016 |
| Safety Verification of AMS Circuits with Piecewise-Linear System Reachability Analysis S Kim, H Park, J Kim 2021 18th International SoC Design Conference (ISOCC), 203-206, 2021 | 2 | 2021 |
| Allocation of Always-On State Retention Storage for Power Gated Circuits—Steady-State-Driven Approach T Kim, H Park, T Kim IEEE Transactions on Very Large Scale Integration (VLSI) Systems 29 (3), 499-511, 2021 | 2 | 2021 |
Sung Kyu LimProfessor, Georgia Institute of TechnologyVerified email at ece.gatech.edu
