| Developments in electrochemical discharge machining: A review on electrochemical discharge machining, process variants and their hybrid methods T Singh, A Dvivedi International journal of machine tools and manufacture 105, 1-13, 2016 | 191 | 2016 |
| On performance evaluation of textured tools during micro-channeling with ECDM T Singh, A Dvivedi Journal of Manufacturing Processes 32, 699-713, 2018 | 87 | 2018 |
| On pressurized feeding approach for effective control on working gap in ECDM T Singh, A Dvivedi Materials and Manufacturing Processes 33 (4), 462-473, 2018 | 79 | 2018 |
| Experimental investigations of energy channelization behavior in ultrasonic assisted electrochemical discharge machining T Singh, A Dvivedi, A Shanu, P Dixit Journal of Materials Processing Technology 293, 117084, 2021 | 55 | 2021 |
| Experimental investigations into triplex hybrid process of GA-RDECDM during subtractive processing of MMC’s NK Jha, T Singh, A Dvivedi, S Rajesha Materials and Manufacturing Processes 34 (3), 243-255, 2019 | 42 | 2019 |
| Experimental investigations into rotary mode electrochemical discharge drilling (RM-ECDD) of metal matrix composites T Singh, RK Arya, A Dvivedi Machining Science and Technology 24 (2), 195-226, 2020 | 40 | 2020 |
| On prolongation of discharge regime during ECDM by titrated flow of electrolyte T Singh, A Dvivedi The International Journal of Advanced Manufacturing Technology 107 (3), 1819 …, 2020 | 37 | 2020 |
| Fabrication of micro-slits using W-ECDM process with textured wire surface: An experimental investigation on kerf overcut reduction and straightness improvement T Singh, A Dvivedi, RK Arya Precision Engineering 59, 211-223, 2019 | 34 | 2019 |
| Impact of gas film thickness on the performance of RM-ECDM process during machining of glass T Singh, A Dvivedi Materials and Manufacturing Processes 37 (6), 652-663, 2022 | 33 | 2022 |
| On performance enhancement of electrochemical discharge trepanning (ECDT) process by sonication of tool electrode K Pawariya, A Dvivedi, T Singh Precision Engineering 56, 8-19, 2019 | 32 | 2019 |
| Fabrication of micro holes in Yttria-stabilized zirconia (Y-SZ) by hybrid process of electrochemical discharge machining (ECDM) T Singh, A Dvivedi Ceramics International 47 (16), 23677-23681, 2021 | 24 | 2021 |
| A review on microholes formation in glass-based substrates by electrochemical discharge drilling for MEMS applications T Singh, J Arab, P Dixit Machining Science and Technology 26 (2), 276-337, 2022 | 23 | 2022 |
| Improvement in energy channelization behaviour during micro hole formation in Y-SZ ceramic with magnetic field assisted ECSM process T Singh, B Appalanaidu, A Dvivedi Measurement 194, 111079, 2022 | 17 | 2022 |
| Experimental investigations, empirical modeling and multi objective optimization of performance characteristics for ECDD with pressurized feeding method T Singh, RS Rathore, A Dvivedi Measurement 149, 107017, 2020 | 16 | 2020 |
| Finishing of micro-channels using abrasive flow machining G Venkatesh, T Singh, AK Sharma, A Dvivedi Proceedings of the International Conference on Research and Innovations in …, 2014 | 16 | 2014 |
| Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process T Singh, DK Mishra, P Dixit Journal of Applied Electrochemistry 52 (4), 667-682, 2022 | 13 | 2022 |
| Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications DK Mishra, T Singh, P Dixit Materials and Manufacturing Processes 37 (12), 1463-1473, 2022 | 11 | 2022 |
| Developments in tandem micro-machining processes to mitigate the machining issues at micron level: a systematic review, challenges and future opportunities S Sharma, T Singh, A Dvivedi Machining Science and Technology 26 (4), 515-570, 2022 | 10 | 2022 |
| Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging VK Bajpai, H Pandey, T Singh, P Dixit Materials Letters 316, 132033, 2022 | 10 | 2022 |
| Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating H Pandey, T Singh, P Dixit Journal of Manufacturing Processes 82, 569-584, 2022 | 9 | 2022 |
Akshay DvivediProfessor of Mechanical and Industrial Engineering, IIT Roorkeeme.iitr.ac.in의 이메일 확인됨
