| High-efficiency micromachined sub-THz channels for low-cost interconnect for planar integrated circuits B Yu, Y Liu, Y Ye, J Ren, X Liu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 64 (1), 96-105, 2015 | 56 | 2015 |
| A high efficiency E-band CMOS frequency doubler with a compensated transformer-based balun for matching enhancement Y Ye, B Yu, A Tang, B Drouin, QJ Gu IEEE Microwave and Wireless Components Letters 26 (1), 40-42, 2015 | 51 | 2015 |
| Ortho-mode sub-THz interconnect channel for planar chip-to-chip communications B Yu, Y Ye, X Ding, Y Liu, Z Xu, X Liu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 66 (4), 1864-1873, 2017 | 45 | 2017 |
| Low-loss and broadband G-band dielectric interconnect for chip-to-chip communication B Yu, Y Liu, Y Ye, X Liu, QJ Gu IEEE Microwave and Wireless Components Letters 26 (7), 478-480, 2016 | 43 | 2016 |
| A 165-GHz transmitter with 10.6% peak DC-to-RF efficiency and 0.68-pJ/b energy efficiency in 65-nm bulk CMOS Y Ye, B Yu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 64 (12), 4573-4584, 2016 | 31 | 2016 |
| A compact single-cantilever multicontact RF-MEMS switch with enhanced reliability Y Liu, J Liu, B Yu, X Liu IEEE Microwave and Wireless Components Letters 28 (3), 191-193, 2018 | 28 | 2018 |
| High energy-efficiency high bandwidth-density sub-THz interconnect for the “Last-Centimeter” chip-to-chip communications Y Ye, B Yu, X Ding, X Liu, QJ Gu 2017 IEEE MTT-S International Microwave Symposium (IMS), 805-808, 2017 | 14 | 2017 |
| High-integration and low-cost transmitter packaging solution for 0.2 THz SiP application using HTCC technology B Yu, Z Wang, P Wu, O Li, H Cai, J He, G Wang, R Xu IEEE Microwave and Wireless Components Letters 32 (6), 680-683, 2022 | 12 | 2022 |
| Micromachined sub-THz interconnect channels for planar silicon processes B Yu, Y Liu, X Hu, X Ren, X Liu, QJ Gu 2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-3, 2014 | 12 | 2014 |
| A novel dual SCR device for ESD protection Y Bo, W Yuan, J Song, Z Ganggang 2009 IEEE 8th International Conference on ASIC, 789-791, 2009 | 11 | 2009 |
| A G-Band on-off-Keying Low-Power Transmitter and Receiver for Interconnect Systems in 65-nm CMOS Y Wang, B Yu, Y Ye, CN Chen, QJ Gu, H Wang IEEE Transactions on Terahertz Science and Technology 10 (2), 118-132, 2019 | 10 | 2019 |
| THz interconnect for inter-/intra-chip communication QJ Gu, B Yu, X Ding, Y Ye, X Liu, Z Xu Micro-and Nanotechnology Sensors, Systems, and Applications XI 10982, 452-459, 2019 | 10 | 2019 |
| Ring-resonator-based sub-THz dielectric sensor B Yu, X Ding, H Yu, Y Ye, X Liu, QJ Gu IEEE Microwave and Wireless Components Letters 28 (11), 969-971, 2018 | 10 | 2018 |
| Dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications B Yu, Y Ye, X Ding, Y Liu, X Liu, QJ Gu 2017 IEEE MTT-S International Microwave Symposium (IMS), 1750-1752, 2017 | 10 | 2017 |
| Customized meta-waveguide for phase and absorption B Yan, B Yu, J Xu, Y Li, Z Wang, Z Wang, H Ma, C Gong Journal of Physics D: Applied Physics 54 (46), 465102, 2021 | 9 | 2021 |
| Sub-THz interconnect for planar chip-to-chip communications B Yu, Y Ye, X Ding, C Neher, X Liu, Z Xu, QJ Gu 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018 | 9 | 2018 |
| A 165GHz OOK transmitter with 10.6% peak DC-to-RF efficiency in 65nm bulk CMOS Y Ye, B Yu, QJ Gu 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 9 | 2016 |
| A superharmonic injection based G-band quadrature VCO in CMOS X Ding, H Yu, B Yu, Z Xu, QJ Gu 2020 IEEE/MTT-S International Microwave Symposium (IMS), 345-348, 2020 | 8 | 2020 |
| A G-band SPST switch with 2.4-dB insertion loss and minimum 28.5-dB isolation using grounded co-planar waveguide folded coupled line topology in 65-nm CMOS technology Y Wang, CN Chen, Y Ye, YC Chen, B Yu, QJ Gu, H Wang 2017 IEEE MTT-S International Microwave Symposium (IMS), 1718-1721, 2017 | 8 | 2017 |
| Design and Print Terahertz Metamaterials Based on Electrohydrodynamic Jet T Yang, X Li, B Yu, C Gong Micromachines 14 (3), 659, 2023 | 5 | 2023 |
Qun Jane GuUniversity of California, DavisVerified email at ucdavis.edu
