Bo Yu
Title
Cited by
Cited by
Year
High-efficiency micromachined sub-THz channels for low-cost interconnect for planar integrated circuits
B Yu, Y Liu, Y Ye, J Ren, X Liu, QJ Gu
IEEE Transactions on Microwave Theory and Techniques 64 (1), 96-105, 2015
332015
Low-loss and broadband G-band dielectric interconnect for chip-to-chip communication
B Yu, Y Liu, Y Ye, X Liu, QJ Gu
IEEE Microwave and Wireless Components Letters 26 (7), 478-480, 2016
312016
A high efficiency E-band CMOS frequency doubler with a compensated transformer-based balun for matching enhancement
Y Ye, B Yu, A Tang, B Drouin, QJ Gu
IEEE Microwave and Wireless Components Letters 26 (1), 40-42, 2015
252015
A 165-GHz transmitter with 10.6% peak DC-to-RF efficiency and 0.68-pJ/b energy efficiency in 65-nm bulk CMOS
Y Ye, B Yu, QJ Gu
IEEE Transactions on Microwave Theory and Techniques 64 (12), 4573-4584, 2016
242016
Ortho-mode sub-THz interconnect channel for planar chip-to-chip communications
B Yu, Y Ye, X Ding, Y Liu, Z Xu, X Liu, QJ Gu
IEEE Transactions on Microwave Theory and Techniques 66 (4), 1864-1873, 2017
182017
A compact single-cantilever multicontact rf-mems switch with enhanced reliability
Y Liu, J Liu, B Yu, X Liu
IEEE Microwave and Wireless Components Letters 28 (3), 191-193, 2018
152018
Micromachined sub-THz interconnect channels for planar silicon processes
B Yu, Y Liu, X Hu, X Ren, X Liu, QJ Gu
2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-3, 2014
122014
A novel dual SCR device for ESD protection
Y Bo, W Yuan, J Song, Z Ganggang
2009 IEEE 8th International Conference on ASIC, 789-791, 2009
102009
High energy-efficiency high bandwidth-density sub-THz interconnect for the “Last-Centimeter” chip-to-chip communications
Y Ye, B Yu, X Ding, X Liu, QJ Gu
2017 IEEE MTT-S International Microwave Symposium (IMS), 805-808, 2017
72017
A G-band SPST switch with 2.4-dB insertion loss and minimum 28.5-dB isolation using grounded co-planar waveguide folded coupled line topology in 65-nm CMOS technology
Y Wang, CN Chen, Y Ye, YC Chen, B Yu, QJ Gu, H Wang
2017 IEEE MTT-S International Microwave Symposium (IMS), 1718-1721, 2017
62017
Dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications
B Yu, Y Ye, X Ding, Y Liu, X Liu, QJ Gu
2017 IEEE MTT-S International Microwave Symposium (IMS), 1750-1752, 2017
62017
A 165GHz OOK transmitter with 10.6% peak DC-to-RF efficiency in 65nm bulk CMOS
Y Ye, B Yu, QJ Gu
2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016
62016
Ring-resonator-based sub-THz dielectric sensor
B Yu, X Ding, H Yu, Y Ye, X Liu, QJ Gu
IEEE Microwave and Wireless Components Letters 28 (11), 969-971, 2018
42018
Sub-THz interconnect for planar chip-to-chip communications
B Yu, Y Ye, X Ding, C Neher, X Liu, Z Xu, QJ Gu
2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018
42018
A compact 213 GHz CMOS fundamental oscillator with 0.56 mW output power and 3.9% efficiency using a capacitive transformer
H Wang, D Kuzmenko, B Yu, Y Ye, JQ Gu, H Rashtian, X Liu
2017 IEEE MTT-S International Microwave Symposium (IMS), 1711-1714, 2017
42017
Microstrip line based sub-THz interconnect for high energy-efficiency chip-to-chip communications
B Yu, Y Ye, XL Liu, QJ Gu
2016 IEEE International Symposium on Radio-Frequency Integration Technology …, 2016
32016
Sub-THz interconnect channel for planar chip-to-chip communication
B Yu, Y Ye, XL Liu, QJ Gu
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
32016
A 140 GHz, 4 dB Noise-Figure Low-Noise Amplifier Design with the Compensation of Parasitic Capacitance CGS
D Wei, X Ding, H Yu, B Yu, S Ma, QJ Gu, J Ren
2019 IEEE 62nd International Midwest Symposium on Circuits and Systems …, 2019
22019
THz interconnect for inter-/intra-chip communication
QJ Gu, B Yu, X Ding, Y Ye, X Liu, Z Xu
Micro-and Nanotechnology Sensors, Systems, and Applications XI 10982, 109822R, 2019
22019
A 162 GHz Ring Resonator based High Resolution Dielectric Sensor
H Yu, B Yu, X Ding, JS Gómez-Díaz, QJ Gu
2020 IEEE/MTT-S International Microwave Symposium (IMS), 233-236, 2020
12020
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