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Hyunseong Shin
Hyunseong Shin
Associate Professor, Inha University
Verified email at inha.ac.kr - Homepage
Title
Cited by
Cited by
Year
The influence of nanoparticle size on the mechanical properties of polymer nanocomposites and the associated interphase region: A multiscale approach
J Choi, H Shin, S Yang, M Cho
Composite Structures 119, 365-376, 2015
1592015
Effect of interphase percolation on mechanical behavior of nanoparticle-reinforced polymer nanocomposite with filler agglomeration: A multiscale approach
H Shin, S Yang, J Choi, S Chang, M Cho
Chemical Physics Letters 635, 80-85, 2015
1552015
Multiscale homogenization modeling for thermal transport properties of polymer nanocomposites with Kapitza thermal resistance
H Shin, S Yang, S Chang, S Yu, M Cho
Polymer 54 (5), 1543-1554, 2013
972013
A multiscale mechanical model for the effective interphase of SWNT/epoxy nanocomposite
J Choi, H Shin, M Cho
Polymer 89, 159-171, 2016
922016
Fracture toughness enhancement of thermoplastic/epoxy blends by the plastic yield of toughening agents: a multiscale analysis
H Shin, B Kim, JG Han, MY Lee, JK Park, M Cho
Composites Science and Technology 145, 173-180, 2017
602017
Two-step multiscale homogenization for mechanical behaviour of polymeric nanocomposites with nanoparticulate agglomerations
K Baek, H Shin, T Yoo, M Cho
Composites Science and Technology 179, 97-105, 2019
472019
An efficient multiscale homogenization modeling approach to describe hyperelastic behavior of polymer nanocomposites
H Shin, J Choi, M Cho
Composites Science and Technology 175, 128-134, 2019
472019
Toward the constitutive modeling of epoxy matrix: Temperature-accelerated quasi-static molecular simulations consistent with the experimental test
H Park, J Choi, B Kim, S Yang, H Shin, M Cho
Composites Part B: Engineering 142, 131-141, 2018
462018
Homogenization analysis of polymeric nanocomposites containing nanoparticulate clusters
H Shin, K Baek, JG Han, M Cho
Composites Science and Technology 138, 217-224, 2017
462017
Statistical multiscale homogenization approach for analyzing polymer nanocomposites that include model inherent uncertainties of molecular dynamics simulations
H Shin, S Chang, S Yang, BD Youn, M Cho
Composites Part B: Engineering 87, 120-131, 2016
462016
Multiscale modeling of mechanical behaviors of Nano-SiC/epoxy nanocomposites with modified interphase model: Effect of nanoparticle clustering
K Baek, H Shin, M Cho
Composites Science and Technology 203, 108572, 2021
432021
Multiscale homogenization model for thermoelastic behavior of epoxy-based composites with polydisperse SiC nanoparticles
S Chang, S Yang, H Shin, M Cho
Composite Structures 128, 342-353, 2015
382015
Method of scale bridging for thermoelasticity of cross-linked epoxy/SiC nanocomposites at a wide range of temperatures
J Choi, S Yang, S Yu, H Shin, M Cho
Polymer 53 (22), 5178-5189, 2012
362012
A combined molecular dynamics/micromechanics/finite element approach for multiscale constitutive modeling of nanocomposites with interface effects
BJ Yang, H Shin, HK Lee, H Kim
Applied Physics Letters 103 (24), 2013
352013
Multiscale model to predict fatigue crack propagation behavior of thermoset polymeric nanocomposites
H Shin, M Cho
Composites Part A: Applied Science and Manufacturing 99, 23-31, 2017
322017
Contribution of oxygen functional groups in graphene to the mechanical and interfacial behaviour of nanocomposites: Molecular dynamics and micromechanics study
S Yang, H Shin, M Cho
International Journal of Mechanical Sciences 189, 105972, 2021
282021
Influence of nanoparticulate diameter on fracture toughness enhancement of polymer nanocomposites by an interfacial debonding mechanism: A multiscale study
H Wang, H Shin
Engineering Fracture Mechanics 261, 108261, 2022
222022
Molecular dynamics simulation and finite element analysis on mechanical behavior of oxygen functionalized graphene/polymer nanocomposites
S Yang, H Shin, M Cho
Journal of Mechanical Science and Technology 33, 307-314, 2019
212019
Multiscale model to predict fracture toughness of CNT/epoxy nanocomposites
H Shin
Composite Structures 272, 114236, 2021
202021
Thermal residual stress analysis of soldering and lamination processes for fabrication of crystalline silicon photovoltaic modules
H Shin, E Han, N Park, D Kim
Energies 11 (12), 3256, 2018
182018
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Articles 1–20