| Dry-etch selectivity H Ren, JG Yang, J Baek, A Wang, S Park, S Garg, X Chen, NK Ingle US Patent 8,969,212, 2015 | 195 | 2015 |
| Etch remnant removal H Ren, NK Ingle, A Wang US Patent App. 13/791,372, 2013 | 193 | 2013 |
| Dry-etch selectivity H Ren, JG Yang, J Baek, A Wang, S Park, S Garg, X Chen, NK Ingle US Patent 9,384,997, 2016 | 187 | 2016 |
| Pulsed dc plasma etching process and apparatus S Deshmukh, H Ren, J Liu US Patent App. 14/200,779, 2014 | 161 | 2014 |
| Self-aligned interconnects formed using substractive techniques B Mebarki, H Dai, Y Chen, H Ren, M Naik US Patent 9,761,489, 2017 | 76 | 2017 |
| Cobalt fill for advanced interconnects N Bekiaris, Z Wu, H Ren, M Naik, JH Park, M Lee, TH Ha, W Hou, ... 2017 IEEE international interconnect technology conference (IITC), 1-3, 2017 | 70 | 2017 |
| Air gap structure integration using a processing system MB Naik, H Ren, Z Cui US Patent 9,312,168, 2016 | 61 | 2016 |
| Uv-assisted reactive ion etch for copper S Deshmukh, J Liu, H Ren US Patent App. 14/201,892, 2014 | 55 | 2014 |
| Methods for etching a dielectric barrier layer in a dual damascene structure H Ren, CL Kao, S Kang, JTP Pender, SD Nemani, MB Naik US Patent 9,299,577, 2016 | 51 | 2016 |
| Plasma damage effects on low-k porous organosilicate glass H Ren, GA Antonelli, Y Nishi, JL Shohet Journal of Applied Physics 108 (9), 2010 | 41 | 2010 |
| The effects of vacuum ultraviolet radiation on low-k dielectric films H Sinha, H Ren, MT Nichols, JL Lauer, M Tomoyasu, NM Russell, G Jiang, ... Journal of Applied Physics 112 (11), 2012 | 40 | 2012 |
| Uv-assisted reactive ion etch for copper S Deshmukh, J Liu, H Ren US Patent App. 15/273,645, 2017 | 38 | 2017 |
| Process for etching metal using a combination of plasma and solid state sources S Deshmukh, J Johnson, J Liu, H Ren US Patent 9,576,810, 2017 | 35 | 2017 |
| Effects of vacuum ultraviolet and ultraviolet irradiation on ultrathin hafnium-oxide dielectric layers on (100) Si as measured with electron-spin resonance H Ren, SL Cheng, Y Nishi, JL Shohet Applied Physics Letters 96 (19), 2010 | 22 | 2010 |
| Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications MB Naik, SD Nemani, T Koshizawa, H Ren US Patent 9,508,561, 2016 | 18 | 2016 |
| Defects in low-k organosilicate glass and their response to processing as measured with electron-spin resonance H Ren, MT Nichols, G Jiang, GA Antonelli, Y Nishi, JL Shohet Applied Physics Letters 98 (10), 2011 | 18 | 2011 |
| Methods for etching a structure for semiconductor applications H Jiang, H Ren, H Chen, MB Naik US Patent 10,957,533, 2021 | 16 | 2021 |
| Process integration method to tune resistivity of nickel silicide H Ren, M Yu, MB Naik US Patent 10,388,533, 2019 | 16 | 2019 |
| The nature of the defects generated from plasma exposure in pristine and ultraviolet-cured low-k organosilicate glass H Ren, G Jiang, GA Antonelli, Y Nishi, JL Shohet Applied Physics Letters 98 (25), 2011 | 15 | 2011 |
| Surface potential due to charge accumulation during vacuum ultraviolet exposure for high-k and low-k dielectrics H Ren, H Sinha, A Sehgal, MT Nichols, GA Antonelli, Y Nishi, JL Shohet Applied Physics Letters 97 (7), 2010 | 15 | 2010 |
