| Monolithic silicon integration of scaled photonic switch fabrics, CMOS logic, and device driver circuits BG Lee, AV Rylyakov, WMJ Green, S Assefa, CW Baks, ... Journal of Lightwave Technology 32 (4), 743-751, 2014 | 192 | 2014 |
| Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz R Rimolo-Donadio, X Gu, YH Kwark, MB Ritter, B Archambeault, ... IEEE Transactions on Microwave Theory and Techniques 57 (8), 2072-2083, 2009 | 161 | 2009 |
| Is 25 Gb/s on-board signaling viable? DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ... IEEE Transactions on advanced packaging 32 (2), 328-344, 2009 | 92 | 2009 |
| Circular ports in parallel-plate waveguide analysis with isotropic excitations X Duan, R Rimolo-Donadio, HD Brüns, C Schuster IEEE transactions on electromagnetic compatibility 54 (3), 603-612, 2011 | 57 | 2011 |
| A combined method for fast analysis of signal propagation, ground noise, and radiated emission of multilayer printed circuit boards X Duan, R Rimolo-Donadio, HD Brüns, C Schuster IEEE Transactions on Electromagnetic Compatibility 52 (2), 487-495, 2010 | 47 | 2010 |
| Accuracy of physics-based via models for simulation of dense via arrays S Müller, X Duan, M Kotzev, YJ Zhang, J Fan, X Gu, YH Kwark, ... IEEE Transactions on Electromagnetic Compatibility 54 (5), 1125-1136, 2012 | 45 | 2012 |
| A WDM 4× 28Gbps integrated silicon photonic transmitter driven by 32nm CMOS driver ICs A Ramaswamy, JE Roth, EJ Norberg, RS Guzzon, JH Shin, JT Imamura, ... Optical Fiber Communication Conference, Th5B. 5, 2015 | 40 | 2015 |
| Four-and eight-port photonic switches monolithically integrated with digital CMOS logic and driver circuits BG Lee, AV Rylyakov, WMJ Green, S Assefa, CW Baks, ... 2013 Optical Fiber Communication Conference and Exposition and the National …, 2013 | 35 | 2013 |
| Flexible transmitter employing silicon-segmented Mach–Zehnder modulator with 32-nm CMOS distributed driver TN Huynh, N Dupuis, R Rimolo-Donadio, JE Proesel, DM Gill, CW Baks, ... Journal of Lightwave Technology 34 (22), 5129-5136, 2016 | 28 | 2016 |
| Signal integrity: Efficient, physics-based via modeling: Return path, impedance, and stub effect control J Fan, A Hardock, R Rimolo-Donadio, S Müller, YH Kwark, C Schuster IEEE Electromagnetic Compatibility Magazine 3 (1), 76-84, 2014 | 28 | 2014 |
| Complete modeling of large via constellations in multilayer printed circuit boards S Müller, F Happ, X Duan, R Rimolo-Donadio, HD Brüns, C Schuster IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 28 | 2013 |
| 30Gbps optical link utilizing heterogeneously integrated III-V/Si photonics and CMOS circuits N Dupuis, BG Lee, JE Proesel, A Rylyakov, R Rimolo-Donadio, CW Baks, ... OFC 2014, 1-3, 2014 | 27 | 2014 |
| Extension of the contour integral method to anisotropic modes on circular ports X Duan, R Rimolo-Donadio, HD Bruns, C Schuster IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011 | 24 | 2011 |
| Simulation of via interconnects using physics-based models and microwave network parameters R Rimolo-Donadio, AJ Stepan, HD Bruns, JL Drewniak, C Schuster 2008 12th IEEE Workshop on Signal Propagation on Interconnects, 1-4, 2008 | 24 | 2008 |
| Energy-Aware Signal Integrity Analysis for High-Speed PCB Links S Mueller, T Reuschel, R Rimolo-Donadio, YH Kwark, HD Bruns, ... IEEE Transactions on Electromagnetic Compatibility, 2015 | 23 | 2015 |
| Fast physics-based via and trace models for signal and power integrity co-analysis X Gu DesignCon 2010, Santa Clara, CA, Feb., 2010 | 23 | 2010 |
| Including stripline connections into network parameter based via models for fast simulation of interconnects R Rimolo-Donadio, HD Bruns, C Schuster 2009 20th International Zurich Symposium on Electromagnetic Compatibility …, 2009 | 20 | 2009 |
| 30-Gb/s optical link combining heterogeneously integrated III–V/Si photonics with 32-nm CMOS circuits N Dupuis, BG Lee, JE Proesel, A Rylyakov, R Rimolo-Donadio, CW Baks, ... Journal of Lightwave Technology 33 (3), 657-662, 2014 | 17 | 2014 |
| Driver-integrated 56-Gb/s segmented electrode silicon Mach Zehnder modulator using optical-domain equalization BG Lee, N Dupuis, R Rimolo-Donadio, TN Huynh, CW Baks, DM Gill, ... 2017 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2017 | 16 | 2017 |
| Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures M Kotzev, R Rimolo-Donadio, YH Kwark, CW Baks, X Gu, C Schuster IEEE Transactions on Instrumentation and Measurement 61 (12), 3198-3206, 2012 | 15 | 2012 |
Benjamin G. LeeNVIDIA Researchnvidia.com의 이메일 확인됨
