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John H L PANG
John H L PANG
다른 이름John Hock Lye Pang, Pang Hock Lye John
ntu.edu.sg의 이메일 확인됨
제목
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인용
연도
Study of optimal subset size in digital image correlation of speckle pattern images
S Yaofeng, JHL Pang
Optics and lasers in engineering 45 (9), 967-974, 2007
3982007
Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo
Thin solid films 462, 370-375, 2004
2662004
Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study
Y Bai, K Zhou, N Srikanth, JHL Pang, X He, R Wang
RSC advances 6 (42), 35731-35739, 2016
2642016
A review of recent works on inclusions
K Zhou, HJ Hoh, X Wang, LM Keer, JHL Pang, B Song, QJ Wang
Mechanics of Materials 60, 144-158, 2013
2582013
Finite element formulation for a digital image correlation method
Y Sun, JHL Pang, CK Wong, F Su
Applied optics 44 (34), 7357-7363, 2005
2572005
Testing adhesive joints: best practices
LFM Da Silva, DA Dillard, B Blackman, RD Adams
John Wiley & Sons, 2012
2522012
Drop impact reliability testing for lead-free and lead-based soldered IC packages
DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low
Microelectronics reliability 46 (7), 1160-1171, 2006
2192006
Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy
XQ Shi, W Zhou, HLJ Pang, ZP Wang
2141999
Thermal cycling analysis of flip-chip solder joint reliability
JHL Pang, DYR Chong, TH Low
IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2001
2112001
Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy
XQ Shi, HLJ Pang, W Zhou, ZP Wang
International Journal of fatigue 22 (3), 217-228, 2000
2102000
Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging
HLJ Pang, KH Tan, XQ Shi, ZP Wang
Materials Science and Engineering: A 307 (1-2), 42-50, 2001
1932001
Thermo-mechanical model for simulating laser cladding induced residual stresses with single and multiple clad beads
Y Chew, JHL Pang, G Bi, B Song
Journal of Materials Processing Technology 224, 89-101, 2015
1492015
Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder
JHL Pang, BS Xiong, TH Low
2004 proceedings. 54th electronic components and technology conference (IEEE …, 2004
1472004
Electromigration induced ductile-to-brittle transition in lead-free solder joints
F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang
Applied physics letters 89 (14), 2006
1462006
Low cycle fatigue models for lead-free solders
JHL Pang, BS Xiong, TH Low
Thin solid films 462, 408-412, 2004
1452004
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
JHL Pang, L Xu, XQ Shi, W Zhou, SL Ngoh
Journal of Electronic Materials 33, 1219-1226, 2004
1432004
Vibration reliability test and finite element analysis for flip chip solder joints
FX Che, JHL Pang
Microelectronics reliability 49 (7), 754-760, 2009
1362009
Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches
L Zhu, W Marcinkiewicz
IEEE Transactions on Components and Packaging Technologies 28 (3), 449-456, 2005
1342005
Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
L Xu, JHL Pang, F Che
Journal of Electronic Materials 37, 880-886, 2008
1262008
Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging
L Xu, JHL Pang
Thin solid films 504 (1-2), 362-366, 2006
1242006
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