| Shear-induced particle migration in a polydisperse concentrated suspension A Shauly, A Wachs, A Nir Journal of Rheology 42 (6), 1329-1348, 1998 | 114 | 1998 |
| Ethylene compressor monitoring using model‐based PCA Y Rotem, A Wachs, DR Lewin AIChE Journal 46 (9), 1825-1836, 2000 | 85 | 2000 |
| Improved PCA methods for process disturbance and failure identification A Wachs, DR Lewin AIChE journal 45 (8), 1688-1700, 1999 | 81 | 1999 |
| Simulated contact angle hysteresis of a three-dimensional drop on a chemically heterogeneous surface: a numerical example S Brandon, A Wachs, A Marmur Journal of colloid and interface science 191 (1), 110-116, 1997 | 81 | 1997 |
| In situ module for particle removal from solid-state surfaces Y Uziel, D Yogev, E Poles, A Wachs US Patent 6,949,147, 2005 | 50 | 2005 |
| Condensation-based enhancement of particle removal by suction D Yogev, Y Uzeil, L Frisman, A Wachs US Patent 6,799,584, 2004 | 44 | 2004 |
| Shear-induced particle resuspension in settling polydisperse concentrated suspension A Shauly, A Wachs, A Nir International journal of multiphase flow 26 (1), 1-15, 2000 | 37 | 2000 |
| Process monitoring using model-based PCA A Wachs, DR Lewin IFAC Proceedings Volumes 31 (11), 87-92, 1998 | 19 | 1998 |
| Iterative defect filtering process S Shabtay, I Kaizerman, A Wachs US Patent 9,286,675, 2016 | 13 | 2016 |
| Method of quality control in semiconductor device fabrication A Wachs, D Cohen US Patent 6,238,939, 2001 | 13 | 2001 |
| Extreme contact scaling with advanced metallization of cobalt R Hung, JH Park, TH Ha, M Lee, W Hou, J Lei, JR Bakke, S Sharma, ... 2018 IEEE International Interconnect Technology Conference (IITC), 30-32, 2018 | 10 | 2018 |
| Control of a pilot-scale Karr liquid-liquid extraction column A Wachs, J Benyamin, R Semiat, DR Lewin Computers & chemical engineering 21, S601-S606, 1997 | 8 | 1997 |
| Manufacture of ultra-clean surfaces by selective W Huber, J Krueger, Y Uziel, A Wachs US Patent App. 11/128,215, 2006 | 7 | 2006 |
| Electron beam detection of cobalt trench embedded voids enabling improved process control for Middle-Of-Line at the 7nm node and beyond N Breil, D Shemesh, J Fernandez, R Hung, N Bekiaris, J Tseng, M Naik, ... 2017 IEEE International Electron Devices Meeting (IEDM), 14.5. 1-14.5. 4, 2017 | 5 | 2017 |
| Updating of a recipe for evaluating a manufacturing stage of an electrical circuit A Wachs US Patent 9,880,550, 2018 | 4 | 2018 |
| Imaging of crystalline defects D Shemesh, U Lev, B Colombeau, A Wachs, K Nafisi US Patent 10,347,462, 2019 | 3 | 2019 |
| Embedded metal voids detection to improve Copper metallization for advanced interconnect J Tseng, M Naik, A Kumar, K Nafisi, JJ Lee, Z Wu, K Moraes, J Fernandez, ... 2018 IEEE International Interconnect Technology Conference (IITC), 169-171, 2018 | 2 | 2018 |
| Characterization of leveling modes on i-line stepper A Wachs, D Cohen, A Margalit-Ilovich Optical Microlithography XIII 4000, 827-834, 2000 | 2 | 2000 |
| Iterative defect filtering process S Shabtay, I Kaizerman, A Wachs US Patent 10,049,441, 2018 | 1 | 2018 |
| Contaminants removal from epi substrates using vapor-laser process A Wachs, S Zeid, Y Uziel, W Huber, J Krueger Solid State Phenomena 103, 189-192, 2005 | 1 | 2005 |
