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Han-Wool Yeon
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SiGe epitaxial memory for neuromorphic computing with reproducible high performance based on engineered dislocations
S Choi, SH Tan, Z Li, Y Kim, C Choi, PY Chen, H Yeon, S Yu, J Kim
Nature materials 17 (4), 335-340, 2018
4792018
Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials
J Shim, SH Bae, W Kong, D Lee, K Qiao, D Nezich, YJ Park, R Zhao, ...
Science 362 (6415), 665-670, 2018
2082018
Alloying conducting channels for reliable neuromorphic computing
H Yeon, P Lin, C Choi, SH Tan, Y Park, D Lee, J Lee, F Xu, B Gao, H Wu, ...
Nature Nanotechnology 15 (7), 574-579, 2020
1302020
Graphene as an atomically thin barrier to Cu diffusion into Si
J Hong, S Lee, S Lee, H Han, C Mahata, HW Yeon, B Koo, SI Kim, T Nam, ...
Nanoscale 6 (13), 7503-7511, 2014
1032014
Effects of metal electrode on the electrical performance of amorphous In–Ga–Zn–O thin film transistor
JR Yim, SY Jung, HW Yeon, JY Kwon, YJ Lee, JH Lee, YC Joo
Japanese journal of applied physics 51 (1R), 011401, 2011
752011
Effects of metal electrode on the electrical performance of amorphous In–Ga–Zn–O thin film transistor
JR Yim, SY Jung, HW Yeon, JY Kwon, YJ Lee, JH Lee, YC Joo
Japanese journal of applied physics 51 (1R), 011401, 2011
732011
Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins
H Yeon, H Lee, Y Kim, D Lee, Y Lee, JS Lee, J Shin, C Choi, JH Kang, ...
Science Advances 7 (27), eabg8459, 2021
522021
Structural-relaxation-driven electron doping of amorphous oxide semiconductors by increasing the concentration of oxygen vacancies in shallow-donor states
HW Yeon, SM Lim, JK Jung, H Yoo, YJ Lee, HY Kang, YJ Park, M Kim, ...
NPG Asia Materials 8 (3), e250-e250, 2016
292016
Perspective: Uniform switching of artificial synapses for large-scale neuromorphic arrays
SH Tan, P Lin, H Yeon, S Choi, Y Park, J Kim
APL Materials 6 (12), 120901, 2018
242018
Enhanced conductivity of solution-processed indium tin oxide nanoparticle films by oxygen partial pressure controlled annealing
NR Kim, JH Lee, YY Lee, DH Nam, HW Yeon, SY Lee, TY Yang, YJ Lee, ...
Journal of Materials Chemistry C 1 (37), 5953-5959, 2013
242013
One-step structure modulation of electrospun metal-loaded carbon nanofibers: Redox reaction controlled calcination
DH Nam, JH Lee, NR Kim, YY Lee, HW Yeon, SY Lee, YC Joo
Carbon 82, 273-281, 2015
232015
Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors
Y Kim, JM Suh, J Shin, Y Liu, H Yeon, K Qiao, HS Kum, C Kim, HE Lee, ...
Science 377 (6608), 859-864, 2022
202022
Thermally stable amorphous oxide-based Schottky diodes through oxygen vacancy control at metal/oxide interfaces
SM Lim, HW Yeon, GB Lee, MG Jin, SY Lee, J Jo, M Kim, YC Joo
Scientific reports 9 (1), 7872, 2019
132019
Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics
YJ Lee, Y Uk Lee, HW Yeon, HAS Shin, LA Evans, YC Joo
Applied Physics Letters 103 (24), 241904, 2013
132013
Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence
C Choi, H Kim, JH Kang, MK Song, H Yeon, CS Chang, JM Suh, J Shin, ...
Nature Electronics 5 (6), 386-393, 2022
112022
Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer
YJ Lee, HAS Shin, DH Nam, HW Yeon, B Nam, K Woo, YC Joo
Electronic Materials Letters 11, 149-154, 2015
82015
Cu Diffusion‐Driven Dynamic Modulation of the Electrical Properties of Amorphous Oxide Semiconductors
HW Yeon, J Jo, H Song, Y Kang, S Na, H Yoo, SY Lee, H Cho, HY Kang, ...
Advanced Functional Materials 27 (25), 1700336, 2017
72017
Electromigration behavior of advanced metallization on the structural effects for memory devices
KT Jang, YJ Park, MW Jeong, SM Lim, HW Yeon, JY Cho, MG Jin, JS Shin, ...
Microelectronic Engineering 156, 97-102, 2016
52016
Cu contamination of the nMOSFET in a 3-D integrated circuit under thermal and electrical stress
HW Yeon, SY Jung, J Lim, J Pyun, H Kim, D Baek, YC Joo
Electrochemical and Solid-State Letters 15 (5), H157, 2012
52012
Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias
YJ Lee, HW Yeon, SY Jung, SK Na, JS Park, YY Choi, HJ Lee, OS Song, ...
Electronic Materials Letters 10, 275-279, 2014
42014
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