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SiGe epitaxial memory for neuromorphic computing with reproducible high performance based on engineered dislocations
S Choi, SH Tan, Z Li, Y Kim, C Choi, PY Chen, H Yeon, S Yu, J Kim
Nature materials 17 (4), 335-340, 2018
5882018
Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials
J Shim, SH Bae, W Kong, D Lee, K Qiao, D Nezich, YJ Park, R Zhao, ...
Science 362 (6415), 665-670, 2018
2612018
Alloying conducting channels for reliable neuromorphic computing
H Yeon, P Lin, C Choi, SH Tan, Y Park, D Lee, J Lee, F Xu, B Gao, H Wu, ...
Nature nanotechnology 15 (7), 574-579, 2020
1892020
Graphene as an atomically thin barrier to Cu diffusion into Si
J Hong, S Lee, S Lee, H Han, C Mahata, HW Yeon, B Koo, SI Kim, T Nam, ...
Nanoscale 6 (13), 7503-7511, 2014
1162014
Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors
Y Kim, JM Suh, J Shin, Y Liu, H Yeon, K Qiao, HS Kum, C Kim, HE Lee, ...
Science 377 (6608), 859-864, 2022
962022
Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins
H Yeon, H Lee, Y Kim, D Lee, Y Lee, JS Lee, J Shin, C Choi, JH Kang, ...
Science Advances 7 (27), eabg8459, 2021
892021
Vertical full-colour micro-LEDs via 2D materials-based layer transfer
J Shin, H Kim, S Sundaram, J Jeong, BI Park, CS Chang, J Choi, T Kim, ...
Nature 614 (7946), 81-87, 2023
842023
Effects of metal electrode on the electrical performance of amorphous In–Ga–Zn–O thin film transistor
JR Yim, SY Jung, HW Yeon, JY Kwon, YJ Lee, JH Lee, YC Joo
Japanese journal of applied physics 51 (1R), 011401, 2011
832011
Effects of metal electrode on the electrical performance of amorphous In–Ga–Zn–O thin film transistor
JR Yim, SY Jung, HW Yeon, JY Kwon, YJ Lee, JH Lee, YC Joo
Japanese journal of applied physics 51 (1R), 011401, 2011
812011
Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence
C Choi, H Kim, JH Kang, MK Song, H Yeon, CS Chang, JM Suh, J Shin, ...
Nature Electronics 5 (6), 386-393, 2022
612022
Recent advances and future prospects for memristive materials, devices, and systems
MK Song, JH Kang, X Zhang, W Ji, A Ascoli, I Messaris, AS Demirkol, ...
ACS nano 17 (13), 11994-12039, 2023
432023
Structural-relaxation-driven electron doping of amorphous oxide semiconductors by increasing the concentration of oxygen vacancies in shallow-donor states
HW Yeon, SM Lim, JK Jung, H Yoo, YJ Lee, HY Kang, YJ Park, M Kim, ...
NPG Asia Materials 8 (3), e250-e250, 2016
392016
Perspective: Uniform switching of artificial synapses for large-scale neuromorphic arrays
SH Tan, P Lin, H Yeon, S Choi, Y Park, J Kim
APL Materials 6 (12), 2018
292018
One-step structure modulation of electrospun metal-loaded carbon nanofibers: Redox reaction controlled calcination
DH Nam, JH Lee, NR Kim, YY Lee, HW Yeon, SY Lee, YC Joo
Carbon 82, 273-281, 2015
282015
Enhanced conductivity of solution-processed indium tin oxide nanoparticle films by oxygen partial pressure controlled annealing
NR Kim, JH Lee, YY Lee, DH Nam, HW Yeon, SY Lee, TY Yang, YJ Lee, ...
Journal of Materials Chemistry C 1 (37), 5953-5959, 2013
272013
Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics
YJ Lee, Y Uk Lee, HW Yeon, HA Shin, LA Evans, YC Joo
Applied Physics Letters 103 (24), 2013
162013
Thermally stable amorphous oxide-based Schottky diodes through oxygen vacancy control at metal/oxide interfaces
SM Lim, HW Yeon, GB Lee, MG Jin, SY Lee, J Jo, M Kim, YC Joo
Scientific reports 9 (1), 7872, 2019
152019
Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias
YJ Lee, HW Yeon, SY Jung, SK Na, JS Park, YY Choi, HJ Lee, OS Song, ...
Electronic Materials Letters 10, 275-279, 2014
132014
Cu Diffusion‐Driven Dynamic Modulation of the Electrical Properties of Amorphous Oxide Semiconductors
HW Yeon, J Jo, H Song, Y Kang, S Na, H Yoo, SY Lee, H Cho, HY Kang, ...
Advanced Functional Materials 27 (25), 1700336, 2017
112017
Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer
YJ Lee, HAS Shin, DH Nam, HW Yeon, B Nam, K Woo, YC Joo
Electronic Materials Letters 11, 149-154, 2015
72015
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