| High-efficiency micromachined sub-THz channels for low-cost interconnect for planar integrated circuits B Yu, Y Liu, Y Ye, J Ren, X Liu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 64 (1), 96-105, 2015 | 56 | 2015 |
| A high efficiency E-band CMOS frequency doubler with a compensated transformer-based balun for matching enhancement Y Ye, B Yu, A Tang, B Drouin, QJ Gu IEEE Microwave and Wireless Components Letters 26 (1), 40-42, 2015 | 51 | 2015 |
| Ortho-mode sub-THz interconnect channel for planar chip-to-chip communications B Yu, Y Ye, X Ding, Y Liu, Z Xu, X Liu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 66 (4), 1864-1873, 2017 | 45 | 2017 |
| Low-loss and broadband G-band dielectric interconnect for chip-to-chip communication B Yu, Y Liu, Y Ye, X Liu, QJ Gu IEEE Microwave and Wireless Components Letters 26 (7), 478-480, 2016 | 43 | 2016 |
| A 165-GHz transmitter with 10.6% peak DC-to-RF efficiency and 0.68-pJ/b energy efficiency in 65-nm bulk CMOS Y Ye, B Yu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 64 (12), 4573-4584, 2016 | 31 | 2016 |
| A W-band 65nm CMOS/InP-hybrid radiometer & passive imager A Tang, T Reck, R Shu, L Samoska, Y Kim, Y Ye, Q Gu, BJ Drouin, ... 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-3, 2016 | 18 | 2016 |
| W-band system-on-chip electron cyclotron emission imaging system on DIII-D Y Zhu, JH Yu, G Yu, Y Ye, B Tobias, A Diallo, G Kramer, Y Ren, ... Review of Scientific Instruments 91 (9), 2020 | 17 | 2020 |
| Liquid crystal polymer receiver modules for electron cyclotron emission imaging on the DIII-D tokamak Y Zhu, Y Ye, JH Yu, B Tobias, AV Pham, Y Wang, C Luo, CW Domier, ... Review of Scientific Instruments 89 (10), 2018 | 16 | 2018 |
| A CMOS millimeter-wave transceiver embedded in a semi-confocal Fabry-Perot cavity for molecular spectroscopy BJ Drouin, A Tang, E Schlecht, E Brageot, QJ Gu, Y Ye, R Shu, ... The Journal of chemical physics 145 (7), 2016 | 16 | 2016 |
| A W-band traveling-wave frequency doubler with output power of 9 dBm and power efficiency of 11.2% Y Ye, J Zhang, XW Sun IEEE Microwave and Wireless Components Letters 24 (10), 704-706, 2014 | 16 | 2014 |
| High energy-efficiency high bandwidth-density sub-THz interconnect for the “Last-Centimeter” chip-to-chip communications Y Ye, B Yu, X Ding, X Liu, QJ Gu 2017 IEEE MTT-S International Microwave Symposium (IMS), 805-808, 2017 | 14 | 2017 |
| System-on-chip upgrade of millimeter-wave imaging diagnostics for fusion plasma Y Zhu, JH Yu, G Yu, Y Ye, Y Chen, B Tobias, A Diallo, G Kramer, Y Ren, ... Review of Scientific Instruments 92 (5), 2021 | 12 | 2021 |
| A bandwidth improved broadband compact lumped-element balun with tail inductor Y Ye, LY Li, JZ Gu, XW Sun IEEE microwave and wireless components letters 23 (8), 415-417, 2013 | 12 | 2013 |
| Millimeter-wave system-on-chip advancement for fusion plasma diagnostics JH Yu, YT Chang, KY Lin, CC Chang, SF Chang, Y Ye, AV Pham, ... Review of Scientific Instruments 89 (10), 2018 | 11 | 2018 |
| A G-Band on-off-Keying Low-Power Transmitter and Receiver for Interconnect Systems in 65-nm CMOS Y Wang, B Yu, Y Ye, CN Chen, QJ Gu, H Wang IEEE Transactions on Terahertz Science and Technology 10 (2), 118-132, 2019 | 10 | 2019 |
| THz interconnect for inter-/intra-chip communication QJ Gu, B Yu, X Ding, Y Ye, X Liu, Z Xu Micro-and Nanotechnology Sensors, Systems, and Applications XI 10982, 452-459, 2019 | 10 | 2019 |
| Ring-resonator-based sub-THz dielectric sensor B Yu, X Ding, H Yu, Y Ye, X Liu, QJ Gu IEEE Microwave and Wireless Components Letters 28 (11), 969-971, 2018 | 10 | 2018 |
| Dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications B Yu, Y Ye, X Ding, Y Liu, X Liu, QJ Gu 2017 IEEE MTT-S International Microwave Symposium (IMS), 1750-1752, 2017 | 10 | 2017 |
| A 165GHz OOK transmitter with 10.6% peak DC-to-RF efficiency in 65nm bulk CMOS Y Ye, B Yu, QJ Gu 2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016 | 10 | 2016 |
| Sub-THz interconnect for planar chip-to-chip communications B Yu, Y Ye, X Ding, C Neher, X Liu, Z Xu, QJ Gu 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018 | 9 | 2018 |
Qun Jane GuUniversity of California, DavisVerified email at ucdavis.edu
