³» ÇÁ·ÎÇÊ ¸¸µé±â
°ø°³ ¾×¼¼½º
¸ðµÎ º¸±âÀÚ·á 20°³
ÀÚ·á 12°³
°ø°³
ºñ°ø°³
ÀçÁ¤ Áö¿ø ¿ä±¸»çÇ× ±âÁØ
°øµ¿ ÀúÀÚ
David GesbertProfessor of Electrical Engineering, Dean and Director at EURECOMeurecom.frÀÇ À̸ÞÀÏ È®ÀεÊ
Vincent LAUChair Professor, HKUSTee.ust.hkÀÇ À̸ÞÀÏ È®ÀεÊ
Urbashi MitraGordon S. Marshall Chair in Engineering, University of Southern Californiausc.eduÀÇ À̸ÞÀÏ È®ÀεÊ
An LiuCollege of Information Science and Electronic Engineering, Zhejiang Universityzju.edu.cnÀÇ À̸ÞÀÏ È®ÀεÊ
Haifan YinProfessor, Huazhong University of Science & Technology. Previous: Huaweieurecom.frÀÇ À̸ÞÀÏ È®ÀεÊ
Laura CottatellucciFriedrich-Alexander University of Erlangen-Nurembergfau.deÀÇ À̸ÞÀÏ È®ÀεÊ
Moe Z. WinNASA Jet Propulsion Laboratory, AT&T Research Labs, Massachusetts Institute of Technology (MIT)mit.eduÀÇ À̸ÞÀÏ È®ÀεÊ
Yuan ShenProfessor, EE, Tsinghua Universitytsinghua.edu.cnÀÇ À̸ÞÀÏ È®ÀεÊ
Wenhan DaiUMass Amherst and MITmit.eduÀÇ À̸ÞÀÏ È®ÀεÊ
James SheHKUSTust.hkÀÇ À̸ÞÀÏ È®ÀεÊ
Omid EsrafilianResearch Engineer at EURECOMeurecom.frÀÇ À̸ÞÀÏ È®ÀεÊ
Fuxin ZhuangMPhil Graduate of Hong Kong University of Science and Technologyalumni.ust.hkÀÇ À̸ÞÀÏ È®ÀεÊ
Ning WangOxford Universitymaths.ox.ac.ukÀÇ À̸ÞÀÏ È®ÀεÊ
Dr. Yong CHENGResearcher, Bell Labs Germanynt.tu-darmstadt.deÀÇ À̸ÞÀÏ È®ÀεÊ