팔로우
Joongnyon Kim
제목
인용
인용
연도
Relationship between wall pressure fluctuations and streamwise vortices in a turbulent boundary layer
J Kim, J Choi, HJ Sung
Physics of Fluids 14 (2), 898-901, 2002
502002
Wall pressure fluctuations and flow-induced noise in a turbulent boundary layer over a bump
J Kim, HJ Sung
Journal of Fluid Mechanics 558, 79-102, 2006
422006
Carbon nanotube covalent bonding mediates extraordinary electron and phonon transports in soft epoxy matrix interface materials
S Lee, D Suh, W Kim, C Xu, T Kim, C Song, C Yoo, Y Kim, J Kim, S Baik
Carbon 157, 12-21, 2020
352020
Display device
H Oh, S Oh, B Han, J Kim
US Patent 10,485,147, 2018
352018
Wall pressure fluctuations in a turbulent boundary layer after blowing or suction
J Kim, K Kim, HJ Sung
AIAA Journal 41 (9), 1697-1704, 2003
342003
Display device
H Oh, J Kim, H Chang, J Kim
US Patent 10,485,148, 2018
262018
Wireless charger for mobile terminal within vehicle, and vehicle
D Koo, J Kim, S Jang, I Ryu, J Lee
US Patent 10,782,752, 2018
212018
An energy-efficient battery thermal management system incorporating a porous metal-based multiscale flow manifold
S Ki, J Lee, S Kim, J Seong, J Shim, S Oh, S Cho, S Bang, D Seo, J Kim, ...
Energy Conversion and Management 269, 116147, 2022
192022
Superhydrophilic catenoidal aluminum micropost evaporator wicks
S Bang, S Ryu, S Ki, K Song, J Kim, J Kim, Y Nam
International Journal of Heat and Mass Transfer 158, 120011, 2020
182020
Wall pressure fluctuations in a turbulent boundary layer over a bump
J Kim, HJ Sung
AIAA Journal 44 (7), 1393-1401, 2006
112006
Thermal optimization of a straight fin heat sink with bypass flow
JW Kim, SH Kim, J Kim
Transactions of the Korean Society of Mechanical Engineers B 34 (2), 179-184, 2010
92010
Microdisplay and Thermal & Fluids Engineering
J Kim
Journal of the KSME 47, 39-43, 2007
82007
Display apparatus
H Chang, J Kim, D Koo, S Han
US Patent 10,653,045, 2018
72018
Display apparatus including a wavelength conversion layer
Y Yoo, M Sung, J Kim
US Patent 9,160,997, 2013
52013
Effect of chip die bonding on thermal resistance of high power LEDs
T Ayodha, HS Han, J Kim, SY Kim
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
22012
Advanced thermal solutions for consumer electronics and vehicle electrification
J Kim
Proceedings of 13th Workshop on Thermal Solutions for IT Electronics, 2022
2022
마그네슘 합금
박성현， 성면창， 김중년
KR Patent App. 10-2022-7,023,550, 2022
2022
전자 장치 및 전자 장치 제어 방법
신은정， 정진원， 김중년， 이유진， 유치종， 안국환
KR Patent App. 10-2022-0,113,044, 2022
2022
불소수지 섬유화 정량화를 위한 방법
유치종， 정진원， 김중년， 이유진， 안국환， 신은정
KR Patent App. 10-2022-0,073,730, 2022
2022
AVN device
J Yu, K Moon, W Jung, J Kim
EP Patent App. 19935607.2, 2022
2022
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학술자료 1–20