Æȷοì
Joongnyon Kim
Á¦¸ñ
Àοë
Àοë
¿¬µµ
Display device
H Oh, S Oh, B Han, J Kim
US Patent 10,485,147, 2018
532018
Relationship between wall pressure fluctuations and streamwise vortices in a turbulent boundary layer
J Kim, J Choi, HJ Sung
Physics of Fluids 14 (2), 898-901, 2002
522002
Wall pressure fluctuations and flow-induced noise in a turbulent boundary layer over a bump
J Kim, HJ Sung
Journal of Fluid Mechanics 558, 79-102, 2006
452006
Display device
H Oh, J Kim, H Chang, J Kim
US Patent 10,485,148, 2018
382018
Carbon nanotube covalent bonding mediates extraordinary electron and phonon transports in soft epoxy matrix interface materials
S Lee, D Suh, W Kim, C Xu, T Kim, C Song, C Yoo, Y Kim, J Kim, S Baik
Carbon 157, 12-21, 2020
362020
Wall pressure fluctuations in a turbulent boundary layer after blowing or suction
J Kim, K Kim, HJ Sung
AIAA Journal 41 (9), 1697-1704, 2003
342003
An energy-efficient battery thermal management system incorporating a porous metal-based multiscale flow manifold
S Ki, J Lee, S Kim, J Seong, J Shim, S Oh, S Cho, S Bang, D Seo, J Kim, ...
Energy Conversion and Management 269, 116147, 2022
252022
Wireless charger for mobile terminal within vehicle, and vehicle
D Koo, J Kim, S Jang, I Ryu, J Lee
US Patent 10,782,752, 2018
232018
Superhydrophilic catenoidal aluminum micropost evaporator wicks
S Bang, S Ryu, S Ki, K Song, J Kim, J Kim, Y Nam
International Journal of Heat and Mass Transfer 158, 120011, 2020
222020
Display apparatus
H Chang, J Kim, D Koo, S Han
US Patent 10,653,045, 2018
192018
Wall pressure fluctuations in a turbulent boundary layer over a bump
J Kim, HJ Sung
AIAA Journal 44 (7), 1393-1401, 2006
112006
Thermal optimization of a straight fin heat sink with bypass flow
JW Kim, SH Kim, J Kim
Transactions of the Korean Society of Mechanical Engineers B 34 (2), 179-184, 2010
92010
Microdisplay and Thermal & Fluids Engineering
J Kim
Journal of the KSME 47, 39-43, 2007
82007
Display apparatus including a wavelength conversion layer
Y Yoo, M Sung, J Kim
US Patent 9,160,997, 2013
52013
Effect of chip die bonding on thermal resistance of high power LEDs
T Ayodha, HS Han, J Kim, SY Kim
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in ¡¦, 2012
22012
Composite thermal insulation sheet including aerogel
KS Oh, JK Lee, BW Han, YS Jeon, SW Park, J Kim
US Patent 11,312,103, 2019
12019
Advanced thermal solutions for consumer electronics and vehicle electrification
J Kim
Proceedings of 13th Workshop on Thermal Solutions for IT Electronics, 2022
2022
¸¶±×³×½· ÇÕ±Ý
¹Ú¼ºÇö£¬ ¼º¸é⣬ ±èÁß³â
KR Patent App. 10-2022-7,023,550, 2022
2022
ÀüÀÚ ÀåÄ¡ ¹× ÀüÀÚ ÀåÄ¡ Á¦¾î ¹æ¹ý
½ÅÀºÁ¤£¬ Á¤Áø¿ø£¬ ±èÁ߳⣬ ÀÌÀ¯Áø£¬ À¯Ä¡Á¾£¬ ¾È±¹È¯
KR Patent App. 10-2022-0,113,044, 2022
2022
ºÒ¼Ò¼öÁö ¼¶À¯È­ Á¤·®È­¸¦ À§ÇÑ ¹æ¹ý
À¯Ä¡Á¾£¬ Á¤Áø¿ø£¬ ±èÁ߳⣬ ÀÌÀ¯Áø£¬ ¾È±¹È¯£¬ ½ÅÀºÁ¤
KR Patent App. 10-2022-0,073,730, 2022
2022
ÇöÀç ½Ã½ºÅÛÀÌ ÀÛµ¿µÇÁö ¾Ê½À´Ï´Ù. ³ªÁß¿¡ ´Ù½Ã ½ÃµµÇØ ÁÖ¼¼¿ä.
ÇмúÀÚ·á 1–20