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Chen Li
Chen Li
Mechanical Engineer - Ayar Labs, Inc.
umich.edu의 이메일 확인됨 - 홈페이지
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High thermal conductivity in electrostatically engineered amorphous polymers
A Shanker, C Li, GH Kim, D Gidley, KP Pipe, J Kim
Science advances 3 (7), e1700342, 2017
1012017
TeraPHY: a chiplet technology for low-power, high-bandwidth in-package optical I/O
M Wade, E Anderson, S Ardalan, P Bhargava, S Buchbinder, ...
IEEE Micro 40 (2), 63-71, 2020
952020
An error-free 1 Tbps WDM optical I/O chiplet and multi-wavelength multi-port laser
M Wade, E Anderson, S Ardalan, W Bae, B Beheshtian, S Buchbinder, ...
Optical Fiber Communication Conference, F3C. 6, 2021
532021
Teraphy: An o-band wdm electro-optic platform for low power, terabit/s optical i/o
C Sun, D Jeong, M Zhang, W Bae, C Zhang, P Bhargava, D Van Orden, ...
2020 IEEE Symposium on VLSI Technology, 1-2, 2020
222020
Feedback-induced failure of high-power diode lasers
PO Leisher, C Li, AK Jha, KP Pipe, JD Helmrich, P Thiagarajan, ...
IEEE Journal of Quantum Electronics 54 (6), 1-13, 2018
162018
Thermal imaging of high power diode lasers subject to back-irradiance
C Li, KP Pipe, C Cao, P Thiagarajan, RJ Deri, PO Leisher
Applied Physics Letters 112 (10), 2018
102018
Thermoreflectance-based measurement of facet optical absorption in high power diode lasers
AK Jha, C Li, KP Pipe, MT Crowley, DB Fullager, JD Helmrich, ...
IEEE Photonics Technology Letters 31 (24), 1909-1912, 2019
92019
Thermoreflectance imaging of back-irradiance heating in high power diode lasers at several operating wavelengths
AK Jha, C Li, KP Pipe, MT Crowley, DB Fullager, JD Helmrich, ...
IEEE Journal of Selected Topics in Quantum Electronics 25 (6), 1-13, 2019
72019
5.12 Tbps co-packaged FPGA and silicon photonics interconnect I/O
K Hosseini, E Kok, SY Shumarayev, D Jeong, A Chan, A Katzin, S Liu, ...
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022
62022
Monolithic microring-based WDM optical I/O for heterogeneous computing
M Wade, D Jeong, B Kim, M Zhang, W Bae, C Zhang, P Bhargava, ...
2021 Symposium on VLSI Circuits, 1-2, 2021
62021
Root cause investigation of back-irradiance-induced failure of high power diode lasers
PO Leisher, D Pope, L Platz, M Boisselle, M Runkel, RJ Deri, S Smith, ...
2017 IEEE High Power Diode Lasers and Systems Conference (HPD), 53-54, 2017
62017
An uncooled CW-WDM MSA compliant multi-wavelength laser source operating from 15-100oC for WDM CMOS applications
MN Sysak, R Roucka, S Liu, C Li, F Luna, J Frey, M Raval, C Zhang, ...
Optical Interconnects XXII 12007, 141-143, 2022
32022
Measurement of facet optical absorption in high power diode lasers using thermoreflectance
AK Jha, C Li, KP Pipe, MT Crowley, DB Fullager, JD Helmrich, ...
2019 IEEE High Power Diode Lasers and Systems Conference (HPD), 25-26, 2019
32019
CCD-based thermoreflectance imaging of high-power diode lasers with back-irradiance
C Li, KP Pipe, C Cao, P Thiagarajan, RJ Deri, PO Leisher
Laser Technology for Defense and Security XIV 10637, 54-61, 2018
32018
Multi-Chip Packaging of Silicon Photonics
CL Roy Meade, Chong Zhang, Haiwei Lu
US Patent App. 17/070,601, 2021
2*2021
Applications of thermoreflectance imaging to high-power diode laser diagnostics
KP Pipe, AK Jha, C Li, MT Crowley, DB Fullager, JD Helmrich, ...
2019 IEEE High Power Diode Lasers and Systems Conference (HPD), 43-44, 2019
22019
Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels
C Li
12019
Thermionic refrigeration at CNT-CNT junctions
C Li, KP Pipe
Applied Physics Letters 109 (16), 2016
12016
Thermionic energy conversion in carbon nanotube networks
C Li, K Pipe
APS March Meeting Abstracts 2016, L35. 002, 2016
12016
Systems and methods for passively-aligned optical waveguide edge-coupling
M Raval, M Sysak, C Li, C Zhang
US Patent 11,762,154, 2023
2023
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학술자료 1–20