Electrical, Optical and Fluidic Through-Silicon Vias for Silicon Interposer Applications MS Parekh, PA Thadesar, MS Bakir 61st IEEE Electronic Components and Technology Conference (ECTC), 1992-1998, 2011 | 54 | 2011 |
Through-silicon vias: drivers, performance, and innovations PA Thadesar, X Gu, R Alapati, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (7 …, 2016 | 52 | 2016 |
Embedded cooling technologies for densely integrated electronic systems TE Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheung, ... 2015 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2015 | 45 | 2015 |
Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers PA Thadesar, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013 | 29 | 2013 |
Fabrication and characterization of polymer-enhanced TSVs, inductors, and antennas for mixed-signal silicon interposer platforms PA Thadesar, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (3 …, 2016 | 26 | 2016 |
In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation X Liu, PA Thadesar, CL Taylor, H Oh, M Kunz, N Tamura, MS Bakir, ... Applied Physics Letters 105 (11), 2014 | 26 | 2014 |
Thermomechanical Strain Measurements by Synchrotron X-ray Diffraction and Data Interpretation for Through-Silicon Vias X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ... Applied Physics Letters 103 (2), 022107-022107-5, 2013 | 26 | 2013 |
Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron X-ray diffraction X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ... Journal of Applied Physics 114 (6), 2013 | 21 | 2013 |
Low-loss air-isolated through-silicon vias for silicon interposers H Oh, PA Thadesar, GS May, MS Bakir IEEE Microwave and Wireless Components Letters 26 (3), 168-170, 2016 | 15 | 2016 |
Endpoint detection in low open area TSV fabrication using optical emission spectroscopy JM Gu, PA Thadesar, A Dembla, MS Bakir, GS May, SJ Hong IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (7 …, 2014 | 13 | 2014 |
Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling PA Thadesar, L Zheng, MS Bakir 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014 | 11 | 2014 |
Silicon interposer featuring novel electrical and optical TSVs PA Thadesar, MS Bakir ASME International Mechanical Engineering Congress and Exposition 45257, 405-412, 2012 | 10 | 2012 |
Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias X Liu, PA Thadesar, CL Taylor, M Kunz, N Tamura, MS Bakir, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (7 …, 2016 | 8 | 2016 |
Mixed-signal substrate with integrated through-substrate vias P Thadesar, MS Bakir US Patent 10,330,874, 2019 | 6 | 2019 |
Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors PA Thadesar, MS Bakir 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 281-286, 2015 | 6 | 2015 |
Novel through-silicon via technologies for 3D system integration PA Thadesar, A Dembla, D Brown, MS Bakir 2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013 | 6 | 2013 |
A microfabricated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ... 2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015 | 5 | 2015 |
Novel Photodefined Polymer-Embedded Vias for Silicon Interposers PA Thadesar, MS Bakir Journal of Micromechanics and Microengineering 23 (3), 035003, 2013 | 5 | 2013 |
Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects C Zhang, P Thadesar, M Zia, T Sarvey, MS Bakir 2014 International 3D Systems Integration Conference (3DIC), 1-4, 2014 | 4 | 2014 |
Integrated filter technology with embedded devices CH Yun, MF Velez, N Park, NS Mudakatte, WC Chen, PA Thadesar, ... US Patent App. 16/132,323, 2020 | 3 | 2020 |