| Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials S Ki, J Shim, S Oh, E Koh, D Seo, S Ryu, J Kim, Y Nam International Journal of Heat and Mass Transfer 170, 121012, 2021 | 54 | 2021 |
| Advanced fan-out package SI/PI/thermal performance analysis of novel RDL packages SH You, S Jeon, D Oh, K Kim, J Kim, SY Cha, GB Kim 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1295-1301, 2018 | 54 | 2018 |
| Thermoelectric cooling packages and thermal management methods thereof JC Kim, J Kim, J Bae, E Cho US Patent 9,228,763, 2016 | 53 | 2016 |
| Recent advances in thermal metamaterials and their future applications for electronics packaging JC Kim, Z Ren, A Yuksel, EM Dede, PR Bandaru, D Oh, J Lee Journal of Electronic Packaging 143 (1), 010801, 2021 | 46 | 2021 |
| Semiconductor devices and methods of controlling temperature thereof JC Kim, E Cho, MN Choi, K Choi, H Hwang, S Bae US Patent 8,692,349, 2014 | 40 | 2014 |
| Semiconductor package having heat spreader and method of forming the same J Kim, HK Kwon, KIM Young-Deuk, JC Kim, JB Byun, H Song, E Cho US Patent App. 13/611,605, 2013 | 40 | 2013 |
| Electronic systems including heterogeneous multi-core processors and methods of operating same MS Ahn, KS Yu, JC Kim, CG Oh, MK Yim US Patent 9,588,577, 2017 | 39 | 2017 |
| Stack package and method of manufacturing the stack package J Kim, J Eon-Soo, E Jung, H Kim, BY Cho US Patent 10,546,844, 2020 | 34 | 2020 |
| TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management Z Ren, Z Yu, JC Kim, J Lee Nanotechnology 30 (3), 035201, 2018 | 29 | 2018 |
| Study of advanced fan-out packages for mobile applications T Hwang, D Oh, E Song, K Kim, J Kim, S Lee 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 343-348, 2018 | 28 | 2018 |
| Image sensor package having multi-level stack structure YH Kim, JC Kim, S Cha, J Kim US Patent 10,541,263, 2020 | 27 | 2020 |
| Semiconductor packages having redistribution substrate J Kim, JC Kim, H Ryu, KS Cho, CHO YoungSang, YH Yoon US Patent 10,347,611, 2019 | 26 | 2019 |
| Electronic device and method of manufacturing the electronic device J Kim, KIM Young-Deuk, WH Park US Patent 10,707,196, 2020 | 24 | 2020 |
| Surface temperature management method of mobile device and memory thermal management method of multichip package H Kwon, JC Kim, E Cho, J Kim US Patent 9,606,591, 2017 | 24 | 2017 |
| Electronic device and method for controlling temperature thereof J Kim, SW Ju, E Cho US Patent 8,988,115, 2015 | 22 | 2015 |
| Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs) J Lee, S Ki, D Seo, J Kim, Y Nam Applied Thermal Engineering 173, 115230, 2020 | 21 | 2020 |
| Application processor and dynamic thermal management method thereof HK Kwon, J Kim, KI Sun US Patent App. 14/104,011, 2014 | 18 | 2014 |
| Semiconductor package including a thermal conductive layer and method of manufacturing the same JC Kim, WH Park, ES Jang, YS Cho US Patent 11,205,604, 2021 | 17 | 2021 |
| Semiconductor package J Kim, JO Chajea, S Han, KS Cho, JC Kim, W Park US Patent 10,510,737, 2019 | 17 | 2019 |
| Chip-on-film packages and device assemblies including the same J Kim, JC Kim, KIM Young-Deuk, E Cho US Patent 9,030,826, 2015 | 17 | 2015 |
