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Co-authors
- Qi LiuFudan UniversityVerified email at ime.ac.cn
- Qing LuoInstitute of Microelectronics, Chinese Academy of SciencesVerified email at ime.ac.cn
- Writam BanerjeeGlobalFoundriesVerified email at globalfoundries.com
- Xumeng ZhangFrontier Institute of Chip and System, Fudan UniversityVerified email at fudan.edu.cn
- Ming WangAssociate Professor, Fudan UniversityVerified email at fudan.edu.cn
- Jianguo YangInstitute of Microelectronics of the Chinese Academy of SciencesVerified email at ime.ac.cn
- Yang LiPeng Cheng LaboratoryVerified email at pcl.ac.cn
- Zhou PengFudan UniversityVerified email at fudan.edu.cn
- Jordi SuñéProfessor, IEEE Fellow, Universitat Autònoma de BarcelonaVerified email at uab.cat
- Qiming HeCRRC Times Semiconductor Inc.Verified email at buaa.edu.cn
- Yuan QinCenter for Power Electronics Systems, Virginia TechVerified email at vt.edu
- Jie YuFrontier Institute of Chip and System, Fudan UniversityVerified email at fudan.edu.cn
- Litao SunProfessor, Southeast UniversityVerified email at seu.edu.cn
- Hong-Yu (Henry) ChenGigaDevice Semiconductor Inc.Verified email at gigadevice.com
- Wei D. LuJames R. Mellor Professor, EECS, Univ of Michigan, IEEE Fellow. co-founder MemryX Inc, Crossbar Inc.Verified email at umich.edu