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- Nenad MiljkovicUniversity of Illinois at Urbana-Champaignillinois.eduÀÇ À̸ÞÀÏ È®ÀεÊ
- Soumyadip SettAssistant Professor, Indian Institute of Technology Gandhinagariitgn.ac.inÀÇ À̸ÞÀÏ È®ÀεÊ
- Xiao Yan (颜áÅ)Chongqing Universitycqu.edu.cnÀÇ À̸ÞÀÏ È®ÀεÊ
- Moonkyung KimStaff Engineer at Samsung Electronics Device Solutions Semiconductor R&D Centerillinois.eduÀÇ À̸ÞÀÏ È®ÀεÊ
- Shreyas ChavanGraduate Student, University of Illinois at Urbana-Champaignillinois.eduÀÇ À̸ÞÀÏ È®ÀεÊ
- Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAhanyang.ac.krÀÇ À̸ÞÀÏ È®ÀεÊ
- Longnan LiChangchun Institute of Optics Fine Mechanics and Physics, Chinese Academy of Sciences; UIUCciomp.ac.cnÀÇ À̸ÞÀÏ È®ÀεÊ
- Daniel OrejonSenior Lecturer Chemical Engineering, Institute Multiacale Thermofluids, The University of Edinburghed.ac.ukÀÇ À̸ÞÀÏ È®ÀεÊ
- Jingcheng MaAssistant Professor, the University of Notre Damend.eduÀÇ À̸ÞÀÏ È®ÀεÊ
- Evelyn N WangMechanical Engineering, MITmit.eduÀÇ À̸ÞÀÏ È®ÀεÊ
- Ryan EnrightSeguente, Nokia Bell Labs, MIT, University of Limerickseguente.techÀÇ À̸ÞÀÏ È®ÀεÊ
Æȷοì
Hyeongyun Cha
University at Buffalo, The State University of New York
buffalo.eduÀÇ À̸ÞÀÏ È®ÀÎµÊ - ȨÆäÀÌÁö