High latent heat storage and high thermal conductive phase change materials using exfoliated graphite nanoplatelets S Kim, LT Drzal Solar Energy Materials and Solar Cells 93 (1), 136-142, 2009 | 529 | 2009 |
The effect of types of maleic anhydride-grafted polypropylene (MAPP) on the interfacial adhesion properties of bio-flour-filled polypropylene composites HS Kim, BH Lee, SW Choi, S Kim, HJ Kim Composites Part A: Applied Science and Manufacturing 38 (6), 1473-1482, 2007 | 513 | 2007 |
Thermal properties of bio-flour-filled polyolefin composites with different compatibilizing agent type and content HS Kim, S Kim, HJ Kim, HS Yang Thermochimica acta 451 (1-2), 181-188, 2006 | 430 | 2006 |
Thermogravimetric analysis of rice husk flour filled thermoplastic polymer composites HS Kim, HS Yang, HJ Kim, HJ Park Journal of thermal analysis and calorimetry 76, 395-404, 2004 | 347 | 2004 |
Bio-composites of kenaf fibers in polylactide: Role of improved interfacial adhesion in the carding process BH Lee, HS Kim, S Lee, HJ Kim, JR Dorgan Composites Science and Technology 69 (15-16), 2573-2579, 2009 | 293 | 2009 |
Effect of different compatibilizing agents on the mechanical properties of lignocellulosic material filled polyethylene bio-composites HS Yang, MP Wolcott, HS Kim, S Kim, HJ Kim Composite Structures 79 (3), 369-375, 2007 | 267 | 2007 |
Environment-friendly adhesives for surface bonding of wood-based flooring using natural tannin to reduce formaldehyde and TVOC emission S Kim Bioresource technology 100 (2), 744-748, 2009 | 253 | 2009 |
Biodegradability and mechanical properties of agro‐flour–filled polybutylene succinate biocomposites HS Kim, HS Yang, HJ Kim Journal of Applied Polymer Science 97 (4), 1513-1521, 2005 | 249 | 2005 |
Application of PCM thermal energy storage system to reduce building energy consumption J Jeon, JH Lee, J Seo, SG Jeong, S Kim Journal of thermal analysis and calorimetry 111, 279-288, 2013 | 236 | 2013 |
Effect of addition of polyvinyl acetate to melamine-formaldehyde resin on the adhesion and formaldehyde emission in engineered flooring S Kim, HJ Kim International Journal of Adhesion and Adhesives 25 (5), 456-461, 2005 | 195 | 2005 |
Bio-based PCM/carbon nanomaterials composites with enhanced thermal conductivity S Yu, SG Jeong, O Chung, S Kim Solar Energy Materials and Solar Cells 120, 549-554, 2014 | 188 | 2014 |
Building materials thermal conductivity measurement and correlation with heat flow meter, laser flash analysis and TCi J Cha, J Seo, S Kim Journal of thermal analysis and calorimetry 109 (1), 295-300, 2012 | 188 | 2012 |
Comparison of standard methods and gas chromatography method in determination of formaldehyde emission from MDF bonded with formaldehyde-based resins S Kim, HJ Kim Bioresource Technology 96 (13), 1457-1464, 2005 | 186 | 2005 |
Preparation of energy efficient paraffinic PCMs/expanded vermiculite and perlite composites for energy saving in buildings O Chung, SG Jeong, S Kim Solar Energy Materials and Solar Cells 137, 107-112, 2015 | 180 | 2015 |
Gasification biochar from biowaste (food waste and wood waste) for effective CO2 adsorption AD Igalavithana, SW Choi, PD Dissanayake, J Shang, CH Wang, X Yang, ... Journal of hazardous materials 391, 121147, 2020 | 179 | 2020 |
Optimal preparation of PCM/diatomite composites for enhancing thermal properties SG Jeong, J Jeon, JH Lee, S Kim International Journal of Heat and Mass Transfer 62, 711-717, 2013 | 165 | 2013 |
Improvement of the thermal properties of Bio-based PCM using exfoliated graphite nanoplatelets SG Jeong, O Chung, S Yu, S Kim, S Kim Solar Energy Materials and Solar Cells 117, 87-92, 2013 | 158 | 2013 |
Properties of lignocellulosic material filled polypropylene bio-composites made with different manufacturing processes HS Yang, MP Wolcott, HS Kim, S Kim, HJ Kim Polymer Testing 25 (5), 668-676, 2006 | 151 | 2006 |
Chemical retreating for gel-typed aerogel and insulation performance of cement containing aerogel S Kim, J Seo, J Cha, S Kim Construction and Building Materials 40, 501-505, 2013 | 146 | 2013 |
Comparison of formaldehyde emission from building finishing materials at various temperatures in under heating system; ONDOL. S Kim, HJ Kim Indoor Air 15 (5), 2005 | 146 | 2005 |